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Reworking QFN's Newly Developed Cost Effective Approach
This paper describes a new rework process for leadless devices where the devices can be manually placed without relying on capital equipment. Credit / Source: Bob Wetterman Best Inc
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As with any rework process, the pasting of the component is a sequential process. Each step is designed to minimize the risk of a smeared solder paste pattern. A typical pad size for a 0.5mm pitch QFN is 0.25mm x 0.4mm and therefore the printing of solder paste using a micro metal rework stencil requires extreme patience and a high degree of skill and experience.
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