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Thank you for being a part of SMTnet. From all of us at SMTnet, we wish you a happy and prosperous New Year! Micro-Sectioning of PCBs for Failure Analysis
Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations. Credit / Source: Bob Wettermann BEST Inc
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Tin plated, for epoxy use. Can be used for both tin/lead and RoHS compliant.
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Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package.
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