BGA Package Component Reliability After Long-Term Storage

In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension for leaded packages beyond a self-imposed two-year limit. The success and acceptance of the Shelf Life Extension Program led to a request for additional data to support extended storage for devices with solder ball interconnects.

This study evaluated 11 devices that were packed using tape and reel packing methods. These devices had been stored in a warehouse environment (<40�C and <90% RH) for periods of time ranging from two to ten years.

Credit / Source: R. Key, B. Lange, R. Madsen | Texas Instruments

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Pad Repair Kit

BEST, INC

The BEST Pad Repair kit includes the tools and materials needed to reliably replace lifted or damaged surface mount and BGA pads on PCB's. This kit includes 3 different tin plated copper base material circuit frame patterns, which offer nearly 3 times as many useable replacement land patterns as other circuit frames. Unlike dry film circuit frames, BEST circuit frames have no shelf life and can be used on both lead-free and tin-lead finish circuit boards.

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