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Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes

Minimum required clearance for multi-nozzle dip processesThe globalization of markets results in stronger competition with clearly noticeably cost pressure. For companies producing electronic equipment it is therefore of existential importance to reduce production costs whilst maintaining a consistently high quality level of the manufactured products. Manual repair soldering that is expensive, time-consuming and cost intensive is already unacceptable due to the required quality and the reproducibility of the whole manufacturing process.

In addition, densely populated multilayer boards and miniaturised, high-pin-count, fine-pitch devices cannot be efficiently repaired with high quality. "Hidden costs", such as productivity rates, operator training and damaged assembly costs have to be taken into consideration as well.

Special focus has to be set to lead-free applications as manual repair soldering processes can cause enormous thermal problems.

Credit / Source: Reiner Zoch, Christian Ott | SEHO Systems GmbH

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