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Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications
The 440 μm thick substrate consists of a 135 μm thick core with via density of about 200 μm. The typical feature sizes in the substrate are 50 micron diameter vias is the core/buildup layers and 12 micron thick metal planes. An experimental test vehicle is powered with current and the temperature rise was measured. Credit / Source: Varaprasad Calmidi, Irv Memis / Endicott Interconnect Technologies
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This paper deals with the thermal effects of joule heating in a high interconnect density, thin core, buildup, organic flip chip substrate.
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