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Drop Shock Reliability of Lead-Free Alloys � Effect of Micro-Additives
Credit / Source: Ranjit S Pandher, Brian G Lewis, Raghasudha Vangaveti, Bawa Singh / Cookson Electronics Cree� XLamp� LED Thermal Management
Credit / Source: Cree, Inc.
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The drop shock reliability of solder joints has become a major issue for the electronic industry partly because of the ever increasing popularity of portable electronics and partly due the transition to lead free solders. Most of the commonly recommended lead-free are high Sn alloys which have relatively higher strength and modulus. This plays a critical role in the reliability of Pb-free solder joints. Further, even though metallugically it is the Sn in the solder alloys that principally participates in the solder joint formation, details of the IMC layers formed with SnPb and Pb-free alloys are different. The markedly different process conditions for SnPb and Pb-free alloys also bear on solder joint quality.
XLamp LEDs lead the solid-state lighting industry in brightness while providing a reflow-solderable design that is optimized for ease of use and thermal management. Lighting applications featuring XLamp LEDs maximize light output and increase design flexibility, while minimizing environmental impact.
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