Over the past several years, post-reflow defluxing of circuit assemblies has gained in popularity. Microminiaturization of components and boards, combined with higher expected reliability and increased product liability, have contributed to the prominence of defluxing. Lead-free solder paste - with its higher reflow temperatures and negative effects on flux - increase the likelihood of post-reflow defluxing to increase a product�s reliability and aesthetic appearance.
Credit / Source: Michael Konrad Aqueous Technologies Corporation
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