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Open product reliability testing in Stockholm, Sweden in January as part of a live production event generated some quite startling results. It was apparent that many components simply cannot handle the high reflow temperatures of a lead-free soldering process, and that many surface-mount machine suppliers are battling significant problems with QFN packages and other components that are mounting edgeways (bill boarding). However, some suppliers have achieved good results.
Since the EU�s Restriction of Hazardous Substances (RoHS) Directive � adopted in 2003 � banned lead in electronics products intended for the EU�s internal market, the transition to a lead-free soldering process has been far from problem-free. But that reliability would turn out to be such a big issue has been a surprise to most in the industry.
Credit / Source: Lars Wallin MYDATA automation
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MV-7 Series

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Designed to automatically inspect for manufacturing defects both pre and post reflow... In-line capability for increased throughput... »»
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G300

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Lead Free Tacking Part 1 (4 min. 36 sec.)
BEST, INC
Best, Inc instructors have put to video demonstrations of common hand soldering skills. These are not designed to be in place of live one on one training where repetitive skills and subsequent one on one feedback is given. Rather they are quick refreshers designed to be viewed if a specific skill has not been practiced in a while.
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electronica & ProductronicaChina 2009
Trade Show/Exhibition | Messe M�nchen GmbH
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As the leading fair for components in China, electronicaChina provides you with everything that a special fair has to offer. And at the same time, it is more than a special fair... »»
CALCE Electronic Product and Systems Consortium Spring Technical Review
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Tue, March 17, 2009 | University of Maryland, College Park, MD, USA
The meeting will provide a chance for EPSC members to review FY09 research findings and to discuss FY10 Research Projects... »»
Successfully Competing Against Low Labor Rate Manufacturers in Electronic Circuit Board Assembly
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Wed, March 18, 2009 | Online Webinar
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