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An Experimental and Computational Study of the Current Carrying Capacity of High Performance PWB Interconnections
Recent technology advancement has enabled enhancement in PWB electrical performance and wiring density. These innovations have taken the form of improved materials, novel PWB interconnect structures, and manufacturing technology. One such advancement is Z-axis conductive interconnect.
The Z-interconnect technology involves building mini-substrates of 2 or 3 layers each, then assembling several mini-substrates together using conductive paste. Designing and manufacturing the mini-substrates separately, then assembling them together, makes it possible to reliably manufacture substrates with no via stubs, very low-loss materials, and high wiring density.
Credit/Source: Michael J. Rowlands, Vara Calmidi Endicott Interconnect Technologies
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