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Method for Automated Nondestructive Analysis of Flip Chip Underfill
For many years Acoustic Micro Imaging (AMI) techniques have been utilized to evaluate the quality of the underfill used to support the solder bump interconnections of Flip Chip type devices. AMI has been established as one of the few techniques that can provide reliability and quality control data, but little has been done to automate the evaluation process for Flip Chip underfill until now.
An automated analysis method has been developed and tested on a variety of Flip Chip structures that provides more consistent and accurate analysis than manual, visual examination by operators. The automated analysis provides unbiased, repeatable evaluation data for part-to-part and lot-to-lot comparisons to ensure that the process is within its control limits, providing a more reliable product.
Credit/Source: Steven R. Martell, Ameya Mandlik, Kieren Mercer Sonoscan, Inc.
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Flat Lead Desoldering Method (4 min. 29 sec.)
BEST, INC
Best, Inc instructors have put to video demonstrations of common hand soldering skills. These are not designed to be in place of live one on one training where repetitive skills and subsequent one on one feedback is given. Rather they are quick refreshers designed to be viewed if a specific skill has not been practiced in a while.
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