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Integrated Offset Placement in Electronics Assembly Equipment � The Answer for Solder Paste Misalignment
Growing demand for compact, multi-function electronics products has accelerated component miniaturization and high-density placement, creating new challenges for the electronics manufacturing industry. It is no longer adequate to simply place parts accurately per a pre-defined CAD assembly program because solder paste alignment errors are increasing for numerous reasons. The solution to this problem is a system in which the placement machine can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of the process errors beforehand.
Credit/Source: Geron Ryden Juki Automation Systems
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We just started build a new product and I am encountering many non-wet rejects in our new product. I need help on what should I look into to improve our Yield... »»
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