High-Speed Stamp Soldering
This article examines stamp soldering, a solution that provides consistent high quality by repeatedly applying accurate amounts of molten solder onto a printed circuit board using static volumetric solder stamps guaranteeing total flatness during the through-hole soldering process.
The increased use of double-sided reflow, widely utilized for high density SMT and through-hole mixedtechnology assemblies, makes these boards susceptible to warpage that adversely affects their planarity during subsequent through-hole soldering. This article looks at stamp soldering, a highly engineered solution that produces consistent high quality results by repeatedly applying accurate amounts of molten solder onto a circuit board using static volumetric solder stamps while guaranteeing total flatness throughout the entire through-hole soldering process.
Credit/Source: Todd O�Neil Juki Automation Systems
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