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Solder Paste Inspection Technologies: 2D-3D Correlation
It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual Surface Mount Technology (SMT) Manufacturing Processes. In addition, transition to lead free solder paste and use of miniature components, has increased the complexity of the printing process. It has been proven that the lead free solder pastes do not spread or �wet� as well as tin lead solder pastes. In general a more accurate printing process is required in a lead free process. This has pushed the manufacturer to implement some type of post-print inspection. (...)
This paper describes correlation between a true 2D area measurement (e.g. printer) and a height map generated area from a SPI system. In addition, this paper will explore the correlation between area/volume measurements and bridge detection between 2D/3D techniques. The ultimate goal is to arm the process engineers with information that can be used to make decision that will impact defects, cost, throughput and Return On Investment.
Credit/Source: Rita Mohanty, Vatsal Shah Speedline Technologies, Inc
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Flat Lead Desoldering Method (4 min. 29 sec.)
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Best, Inc instructors have put to video demonstrations of common hand soldering skills. These are not designed to be in place of live one on one training where repetitive skills and subsequent one on one feedback is given. Rather they are quick refreshers designed to be viewed if a specific skill has not been practiced in a while.
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