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Technical Considerations For Controlling ESD In Electronics Manufacturing
As device geometries get smaller and processing speeds grow faster, their ESD sensitivity increases. Designers face the challenge of fi tting more active component features into smaller chip territory, often at the expense of on-chip protection devices. The trade off is greater risk for ESD damage.
Mastering ESD control has always been critical to achieving high production yields, and it will become even more important in the next few years. While the industry has a solid understanding of ESD safety in manual operations involving personnel, there is room for improvement in automated applications. To be effective, ESD control programs must ensure that automated handling equipment is capable of handling tomorrow�s highly sensitive devices.
Credit/Source: Jon Dautenhahn, Dr. Rita Mohanty Microscan
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MV-2HT Series

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ECM-EXP

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Fully-Automatic, 2,700 CPH Placement of a Wide Range of SMDs, Including 0402s, BGAs, CSPs, and 20 mil QFPs... »»
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Elcoteq #3, Tallinn - Estonia

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High Speed Surface Mount Assembly and Associated Production & Test Equipment...
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Through Hole Component Prep Xmas Tree Method (4 min. 59 sec.)
BEST, INC
Best, Inc instructors have put to video demonstrations of common hand soldering skills. These are not designed to be in place of live one on one training where repetitive skills and subsequent one on one feedback is given. Rather they are quick refreshers designed to be viewed if a specific skill has not been practiced in a while.
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SMT/HYBRID/PACKAGING 2008
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Tue, June 03, 2008 | ExhibitionCentre Nuremberg, Germany
Europe`s leading event for System Integration in Micro Electronics - presents the latest trends, developments and up-to-date solutions... »»
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SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info
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