In "Thick-Film Technology And Applications", Malcolm R. Haskard and Keith Pitt, discuss production process and design issues of thick film technology, focusing on high fire [850 to 950°C] processes. The authors are knowledgeable and respected in the field. This a very good book for process, quality, and design engineers desiring a better understanding of current thick film technology. The book is well written and includes ample references.

Chapters of the book are: Introduction To Thick-Film Technology, Process Technology, Pastes And Substrates, Thick-Film Components, Assembly, Packaging and Testing, Cleanliness, Quality and Safety, Circuit Design and Applications, Thick-Film Sensors, High Speed and Microwave Thick-Film Hybrids, and Recent Developments. Appendices discuss computer aided hybrid layout software for personal computers that is included with the book.

The first half of the book is aimed primarily at production process issues.

Process Technology describes printing and printers, screens and screen fabrication, thick film printing, drying and dryers, the firing process and ovens, resistor trimming and trimmers, soldering to thick film substrates, and in-process controls aspects of thick film processing.

Pastes And Substrates describes the range of paste materials and substrates, focusing on "glaze technology" through the rheology and properties of "pastes" ["inks"] and the final film developed through processes. The chapter makes the distinction between high fire and polymer thick films, a parallel, separate technology.

Thick-Film Components expands on the base understanding of thick film technologies from the previous chapter to making component selection decisions based on either availability of surface mount components or the ability to construct components from this technology. The final section of the chapter addresses thick film and hybrid reliability issues, including an analysis of the factors that affect reliability and yield of processes from design through encapsulation.

Printing, firing, and trimming of substrates comprise the first portion of the manufacturing process. Assembly, Packaging and Testing addresses the many circuit elements that can not be printed, or are not desirable to print, and must be added in chip or discrete component form. Except for possibly the section on wire bonding, these processes are familiar to most involved with surface mount assembly.

While it depends on many factors, the inherent design quality, number of connections, and cleanliness of the manufacturing process are the primary determinants of ultimate reliability of a product. The Cleanliness, Quality and Safety chapter addresses the quality of in-bound materials, operator, and production environment issues that affect product quality.

The second half of the book is aimed primarily at design issues.

Circuit Design and Applications considers the range and quality of components types that can be produced in a manufacturing facility, layout rules, general design philosophy, and use of computer aided design techniques in undertaking actual product designs.

Thick-Film Sensors addresses this rapidly growing application of thick film technology. The chapter discusses sensors that rely either on the properties of a thick film paste or on conventional circuit techniques.

Microwave thick film hybrids have been widely used because of their potential for mass production. Both hybrid circuits and surface mount circuits attached to conventional organic substrates have attractive features for use in communication products. High Speed and Microwave Thick-Film Hybrids describe the factors [eg, track width and spacing, resistor area and power dissipation, crossovers, multilayer structures, etc] that designers consider in designing these circuits.

Recent Developments discusses the potential for interchangeability of thick film materials made by different suppliers and materials being developed that have potential application as thick film sensors.