share the DFX Design Guideline Views: 353

share the DFX Design Guideline	Pengliang	10/05/09
share the DFX Design Guideline	davef	10/06/09
share the DFX Design Guideline	davef	10/13/09

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Date: October 05, 2009 05:08 AM
Author: Pengliang  
Subject: share the DFX Design Guideline

Hello
we'll share DFX Design Guideline
as attached
i hope dicuss with you
MSN:liang.pung@hotmail.com

Attachments: DFX Design Guideline.pdf

(http://www.smtnet.com/distributed_forums/Index.cfm?CFApp=8&Message_ID=60047)

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Date: October 06, 2009 03:49 PM
Author: davef  
Subject: share the DFX Design Guideline


As a start, consider running 'spell check' if you intend to keep the English portion.

(http://www.smtnet.com/distributed_forums/Index.cfm?CFApp=8&Message_ID=60056)

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Date: October 13, 2009 12:32 PM
Author: davef  
Subject: share the DFX Design Guideline


2.6.3 Test Pad Location Tolerances, third bullet. Why does Entek require different test point spacing than other surface finishes?

Page 55, top image is off the page, partially.

2.3.6 Depanelization of Arrays, 10th bullet [Breakaway Scoring] refers to "using a Lihr Hermann machine." What is this machine?

3.3.3 Thieving Pad Required for Wave Soldering Multi-leaded Devices, Table: "intersatitial" [2 places] should be "interstitial (staggered leads)"

3.4.6 SOICs [reflow]: Gives pads and pad layout for "wave" rather than reflow

(http://www.smtnet.com/distributed_forums/Index.cfm?CFApp=8&Message_ID=60102)