Solder Ball Criteria Views: 2226

Solder Ball Criteria				Isagani	03/16/09
Solder Ball Criteria				davef	03/17/09
Solder Ball Criteria				ScottE	03/17/09
	Solder Ball Criteria			blnorman	03/23/09
		Solder Ball Criteria		Mag10	10/23/09
			Solder Ball Criteria	davef	10/24/09
			Solder Ball Criteria	Loco	10/26/09

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Date: March 16, 2009 01:57 AM
Author: Isagani  
Subject: Solder Ball Criteria

Hi Guys
Could you give me the standard criteria that is being followed for solder ball in PCBA. I am aware that we have an IPC standard but still that is generic in nature. I need a one that is applicable for automotive industry.

(http://www.smtnet.com/distributed_forums/Index.cfm?CFApp=8&Message_ID=58356)

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Date: March 17, 2009 07:32 AM
Author: davef  
Subject: Solder Ball Criteria


Solder ball acceptance: IPC-A-610, 6.5.3.1 & 12.4.10. Solder balls: 5 ball system:
* No more than 5 balls per square inch (100mm2) allowed
* Solder balls can not be greater than 5 mil (0.005in) (100um)
* Solder balls cannot be less than 5 mil (100um) from the nearest land or trace

We doubt the above references the latest and greatest A-610 verson, but who cares?

(http://www.smtnet.com/distributed_forums/Index.cfm?CFApp=8&Message_ID=58367)

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Date: March 17, 2009 08:20 AM
Author: ScottE  
Subject: Solder Ball Criteria


I work for one of the largest automotive suppliers. Our Workmanship Standards pre-date IPC-610 but they are nearly identical in regards to solder balls. We supply to all the major OEMs, including the Japanese, and I don't recall our solder ball standard ever being questioned.

(http://www.smtnet.com/distributed_forums/Index.cfm?CFApp=8&Message_ID=58369)

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Date: March 23, 2009 05:14 PM
Author: blnorman  
Subject: Solder Ball Criteria


That's one of the old IPC-A-610 revs. The latest, Rev D removed the size allowables and put in a general criteria statement(section 5.2.6.1).

(http://www.smtnet.com/distributed_forums/Index.cfm?CFApp=8&Message_ID=58415)

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Date: October 23, 2009 03:43 PM
Author: Mag10  
Subject: Solder Ball Criteria


According to 5.2.6.1, it states that defected if Solder balls are not entrapped in no-clean residue or conformal coating. How do you define entrapment or how do you assess if the balls won't dislodge under normal product service environment?
The solder ball is attached to no-clean flux and it does not fall off with brush sweeping. I found difficulty to determine whether the solder ball will dislodge. Can anyone opinion whether it's defective or acceptable based on the photo?

Attachments: solderball entrapped7.jpg, solderball entrapped10.jpg

(http://www.smtnet.com/distributed_forums/Index.cfm?CFApp=8&Message_ID=60172)

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Date: October 24, 2009 12:11 PM
Author: davef  
Subject: Solder Ball Criteria


We don't understand the normal product service environment of your product.

(http://www.smtnet.com/distributed_forums/Index.cfm?CFApp=8&Message_ID=60176)

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Date: October 26, 2009 06:57 AM
Author: Loco  
Subject: Solder Ball Criteria


That's the thing, IPC states you can leave solderballs on if they are stuck on securely... We are never sure they are, so we remove all solderballs.

(http://www.smtnet.com/distributed_forums/Index.cfm?CFApp=8&Message_ID=60180)