TMT-HA300 Hot Air Rework Tool

TMT-HA300 Hot Air Rework Tool Description:

The TMT-HA300 hot air tool uses a large diaphragm pump and can be used for surface mount component removal and reflow on components such as SOIC, CHIP, QFP, PLCC and others.

The Thermaltronics TMT-HA300 Hot Air Tool is a portable and flexible hot air rework system. The Thermaltronics TMT-HA300 Hot Air Tool allows the user to set the temperature of the air and the flow rate of the air thus allowing full control of the temperature profile selected for the removal of components. The rework operator selects the appropriate nozzle for the component to be removed and then proceeds to heat the device to its reflow state where it can be safely removed allowing the pcb to be prepared for the soldering of the new device.

The Thermaltronics TMT-HA300 Hot Air Tool offers high performance at an economic price level and is therefore suitable for both low and high volume rework applications.

• Digital display shows temperature and status.
• Airflow meter provides visual feedback of air flow.
• Large selection of high quality nozzles.
• Adjustable, easy to use temperature and air control knobs.