TMT-HA050 Hot Air Rework Tool

TMT-HA050 Hot Air Rework Tool Description:

The TMT-HA050 hot air tool can be used for the removal of surface mount components such as SOIC, QFP, PLCC and other similar devices.

The Thermaltronics TMT-HA050  hot air tool is a portable and flexible hot air rework system.  The Thermaltronics TMT-HA200 Hot Air Tool allows the user to set the temperature of the air and the flow rate of the air thus allowing full control of the temperature profile selected for the removal of components.  The rework operator selects the appropriate nozzle for the component to be removed and then proceeds to heat the device to its reflow state where it can be safely removed allowing the pcb to be prepared for the soldering of the new device.  The Thermaltronics TMT-HA050 hot air tool offers high performance at an economic price level and is therefore suitable for both low and high volume rework applications.

The TMT-HA050 is suitable for the removal of surface mount components such as SOIC, QFP, PLCC and other similar devices.

• Digital display shows temperature and air flow
• Light, portable, plug and use tool
• Uses HTN Series Hot Air Nozzles
• Convection heating allows low pressure hot air to focus on solder joints