Amphenol Printed Circuits’ (APC) capabilities are among the world’s broadest and most advanced, delivering consistent quality and reliability for demanding high-bandwidth systems and mission critical applications for more than 30 years. Proven engineering and manufacturing expertise eliminates design obstacles. The 214,000 square foot New Hampshire facility features state-of-the-art PCB manufacturing equipment and optimized material handling to ensure the highest quality and consistency. Our Flex and Rigid-Flex assembly located in Nashua, New Hampshire and Nogales, Mexico are fully ITAR qualified.
Amphenol Printed Circuit Board Technology Postings
Sep 15, 2016 | Eva McDermott, Ph.D., Bob McGrath, and Christine Harrington
This paper describes the purpose, methodology, and results to date of thermal endurance testing performed at the company. The intent of this thermal aging testing is to establish long term reliability data for printed wiring board (PWB) materials for use in applications that require 20+ years (100,000+ hours) of operational life under different thermal conditions. Underwriters Laboratory (UL) testing only addresses unclad laminate (resin and glass) and not a fabricated PWB that undergoes many processing steps, includes copper and plated through holes, and has a complex mechanical structure. UL testing is based on a 5000 hour expected operation life of the electronic product. Therefore, there is a need to determine the dielectric breakdown / degradation of the composite printed circuit board material and mechanical structure over time and temperature for mission critical applications....