Condor Sigma W12 Bond Tester - Ideal Solution for 300mm (12 inch) Wafer Testing

Condor Sigma W12 Bond Tester - Ideal Solution for 300mm (12 inch) Wafer Testing Description:

Fully integrated solution for automated wafer testing (up to 300 mm).

The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the tool and cameras in record speed. The 30nm resolution linear encoders ensure accurate positioning.

The Condor Sigma automation features ensure rapid testing of randomly selected positions on the wafer. Fiducial mark recognition can guarantee a high repeatability. Cameras also assist the operator to perform grading. The grading run functionality enables quick grading after a sequence of tests.

The Condor Sigma W12 can be equipped with up to two perpendicular cameras and a camera mounted on a trinocular microscope. We recommend using a low and a high magnification camera for best positioning and grading. A second monitor can show (live) camera images for ease of operation.

• Precision shear testing and Cold Bump Pull (CBP)
• Big bump removal to prepare for wafer probing
• Bump sizes down to 20µm
• Available with or without wafer handler (EFEM)
• XY mapping coordinates key in function
• Grading run functionality
• Up to 4 USB Tweezers in 1 RMU
• Easy positioning, alignment
• High resolution cameras with high and low magnifications
• Fastest throughput of wafer bump testing in the world
• 500mm X-stage and 370mm Y-stage, throat depth 400mm
• Integrated report editor and flexible data export
• Reach 100% of the 300mm wafer without repositioning the wafer on the chuck
• Blower and vacuum tool cleaning unit
• Wafer chuck with safety interlocks and 360 degree rotation
• Wafer carrier mechanically locked when vacuum is turned on
• Complies with JEDEC JESD22-B117A, JEDEC JESD22-B115 and JEITA EIAJ ET-7407 standards
• Also suitable for 200mm (8 inch) and other wafer sizes
• 24 bit ADC resolution, 10kHz sampling frequency
• Compatible with Revolving Measurement Unit (RMU) and single heads
• Unparallelled 0.075% accuracy

Big bumps

To prepare for wafer probing, big bumps need to be removed by shearing them off and cleaning any debris. Fully programmable vision algorithms are used to check if big bumps are successfully removed.

Revolving Measurement Unit

Compatibility with the XYZTEC Revolving Measurement Unit (RMU) ensures that you can switch between test types and tools with the press of a button. Unused sensors (cartridges) are protected within the machine. The RMU can hold up to 6 sensors in any combination, including up to 4 USB Tweezers.

XY mapping

The XY mapping function enables the operator to quickly and accurately move from position to position on the wafer by keying in a relative move. Naturally, the Condor Sigma W12 is equipped with 30nm resolution linear encoders, ensuring 0,5µm repeatability.

Wafer handlers (EFEM)

The Condor Sigma W12 can be integrated with various types of wafer handlers (Equipment Front End Module, EFEM). Integration transforms the bond tester into a fully automated system.

We offer leading edge products for up to 300 mm equipment frontend module platforms.

Among our customers are the world’s top 4 semiconductor packaging houses, which require high precision, fully automated, low vibration, maximum throughput and extensive safety features.

The Condor Sigma W12 features automatic wafer size detection, PID controlled centered lift pins for with guaranteed secure wafer loading and un-loading.

Please contact us for more information and your specific wishes. We have experience with various wafer handler suppliers.

Worldwide customer service

XYZTEC is market leader in Europe and Taiwan and growing rapidly in other territories around the world, including the United States of America. One of the keys to this success is that we have organized our service and support both locally and internationally via our own organization and our partners. Spare parts are available locally, to ensure that we can solve problems quickly.