Intrinsiq Materials Inc.

Intrinsiq Materials manufactures a variety of electronic ink, including screen-printable, and inkjetable copper ink, a silicon ink jet, and a nickel ink jet.

Manufacturer of Assembly Material, Components/Substrates

Intrinsiq Materials manufactures highly functional electronic inks for use at room temperature, in air, enabling printed electronics today and into the future.

Intrinsiq Materials develop solutions for the printed electronics industry. Our customized, air-handleable electronic inks and pastes are a greener, lower-cost alternative to conventional electronic printing materials. Because we utilize a unique manufacturing process, our nano-material based ink is highly functional. It can be deposited via commercially available inkjet and screen printers in a room-temperature environment and sintered using commercial broadband flash systems or laser systems.

Intrinsiq Materials has both in-house development and production tools for nanomaterials, material modifications and ink formulations. Our proprietary nanoparticle generation process is capable of producing controlled particle sizes. Particles can be smaller than 10 nm. Our particle coating methodology produces stable and non-agglomerating nanomaterials. The resulting fine, non-agglomerating powder will readily disperse in ink formulations. It contains a coating that protects it from oxidation which would otherwise negatively affect the electronic performance.

Our inkjet and screen paste formulation expertise provides our customers with the appropriate particle sizing, shape, metal load and solvent composition. For the INSPIRED programme we will be developing new optimised inks to match the end user requirements in the programme three main application areas, as well as developing new scale up routes, options and optimization for the manufacturing process.

Intrinsiq Materials Inc. Postings

2 technical articles »

Factors Affecting the Adhesion of Thin Film Copper on Polyimide

Nov 22, 2017 | David Ciufo, Hsin-Yi Tsai and Michael J. Carmody

The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.

In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important....

Nanocopper Based Paste for Solid Copper Via Fill

Mar 03, 2016 | David Ciufo, Sujatha Ramanujan, Janet Heyen, Michael Carmody; Intrinsiq Materials, Sunny Patel; Candor Industries.

This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper. The resultant paste is injected or fills a via. The via is subsequently sintered by means of photonic sintering, or by heat in a reducing environment. The process will be accomplished in under an hour and results in filled solid copper vias....

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