iJet-8 Multi-function Jetting Dispenser

iJet-8 Multi-function Jetting Dispenser Description:

SMT and PCB Packaging, Semiconductor Packaging, LED Packaging, Electromechanical Assembly, Flat Panel Assembly, etc.

Features and Benefits

• Convenience – With non-contact injection technology, the need to move the z-axis up and down is eliminated.
• Viscosity Control – Designed with automatic temperature (viscosity) control, which ensures consistent material flow.
• Accuracy – CCD vision correction ensures greater fluid dispensing precision.
• Customization – Selection of dispensing valves to suit your fluid dispensing application.
• Seamless Process – Productivity levels will be enhanced, without any disruptions from PCB warpage.
• Quality Assurance – Your business can be assured of a high quality solution for your fluid dispensing needs.

Applications

• Underfill
• BGA Edge Bonding
• SMT Adhesive Glue Dot Dispensing
• SMT Solder Paste Dispensing
• LED Packaging
• FPC Packaging