Eureka XDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet

Eureka XDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Description:

Eureka Dry Tech XDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs:

http://www.eurekadrytech.com/fast-super-dryer/xdc-1001

Capacity: 657 Liters
Humidity Range: LESS THAN 5%
Recovery Time: Recovers to ≤ 5% RH within 30 minutes after accessing door for 30 seconds or less.
External Dimension: 60*193*76 cm (W*H*D)
Internal Dimension: 56*174*61 cm (W*H*D)
Door Type: Anti-Static Glass
Hygrometer: German Digital TESTO Thermal Hygrometer
Power Consumption: 100 Watts
Lock Type: Standard

Anti-static Glass,
Anti-static Paint on Body and Shelves,
​Anti-static Caster / Stands,
1 M ω Ground Wire

Eureka’s dry cabinets, dry boxes, and desiccators will provide ultra-low humidity storage environment conforming to IPC/JEDEC J-STD 033 & IPC-1601, storage and handling standards for MSDs and PCBs allowing traceability of your products.

Features of Eureka Fast Super Dryer’s Ultra-low Humidity Storage:

• EUREKA XDC-1001 FAST SUPER DRYERS With humidity Range of <5% RH WITH FAST RECOVERY TIMES.

• FUNCTIONS IN AMBIENT TEMPERATURE AND PRESSURE (NTP) CONDITIONS WITHOUT USING COSTLY NITROGEN (N2) OR DRY AIR PURGING.

• MOISTURE IS REMOVED AND EXPELLED FROM THE CABINETS BY THE USE OF DESICCANT DEHUMIDIFIERS WHICH AUTOMATICALLY REGENERATES. NO FANS ARE REQUIRED TO VENTILATE.

• DUAL HYGROMETER SENSOR DESIGNS WITH INDEPENDENT HYGROMETER MONITORING RELATIVE HUMIDITY LEVELS INSIDE THE CABINET.

• EUREKA’S FAST SUPER DRYER WILL PROVIDE MOISTURE SENSITIVE DEVICES INDEFINITE FLOOR-LIFE AND RESETTING SHELF LIFE MEETING IPC/JEDEC J-STD 033 STANDARDS.

• EUREKA’S DRY CABINETS WILL PROVIDE STORAGE ENVIRONMENT MEETING IPC 1601 STANDARDS OPTIMAL FOR MULTI-LAYER PRINTED CIRCUIT BOARD / PRINTED WIRE BOARDS.

• ALL OF EUREKA’S FAST SUPER DRYER DRY CABINETS ARE EQUIPPED WITH ANTI-STATIC PAINT, GLASS, CASTERS AND 1M OHM GROUNDING CABLE MEETING IEC-61340-5-1 (ESD) STANDARD.

Solving Issues with Traditional Industry Drying Methods

Eureka’s dry cabinets, dry boxes, and desiccators will provide ultra-low humidity storage environment conforming to IPC/JEDEC J-STD 033 & IPC-1601, storage and handling standards for MSDs and PCBs.

• Eureka Fast Super Dryer also dehumidifies during storage, providing alternative drying methods optimal for removing moisture in all moisture sensitive materials in SMT production, solving all moisture damage problems during reflow process.

• Baking process uses high temperature to dry PCBs which causes breakdowns of protective coatings, lead oxidation, intermetallic buildup and warping that reduces solder ability of circuit boards.

• Nitrogen and dry air purge is costly and will only provide a storage environment by forcing moisture from the storage cabinet. Nitrogen (N2) purging does not have drying capabilities to remove moisture that has absorbed into the moisture sensitive materials, components or devices.

• Moisture barrier bags (MBBs), requires a vacuum sealer, desiccant packs, humidity indicator cards (HICs) and extra man hours. MBBs are ineffective when improperly sealed.