Bonding Wire

Bonding Wire Description:

Gold / Aluminum / Copper Bonding Wires

The bonding wires is the most important material used in making electrical connections between the chip and the external circuit. It has good conductivity and corrosion resistance, and it could be used for extra high speed bonding. So it widely used in microelectronics industry. We provide all sorts of gold bonding wires, aluminum bonding wires, Copper bonding wires and gold target and others alloy for evaporating and target is suitable for semiconductor and else domain.

Gold Bonding Wires

The gold bonding wires are manufactured from high-purity starting materials (99,999 %) with doping additions. New applications and their increased requirements led to the development of alloyed gold bonding wires. All wires are corrosion resistant and display homogeneous chemical composition and stable mechanical properties.

The wire surfaces are very clean and of high quality. Gold bonding wires are principally used in the production of plastic packaged components. The highest processing rates are achieved by using the ball/wedge bonding process.

Ball Bonding Gold Wires

We offer wide selection of gold ball bonding wires in a full range of diameters to suit your applications, from high-power and discrete components to high pin-count, ultra-fine pitch devices.

Wedge Bonding Gold Wires

Our wedge bonding gold wires are optimized for tail and loop consistency and provide excellent bondability for high-frequency and opto-electronic applications. 

Stud Bumping Gold Wires

The gold wire are products specifically for advanced stud bumping of wafers and other materials used in flip-chip and chip-to-chip applications. 

Aluminum Fine Wires

• Bonding wires of aluminum and aluminum alloys are used everywhere a low processing temperature is needed. 
• Economics also play a role because there is a saving on precious metals. The wires are mainly
• processed by the wedge/wedge process.
• The aluminum bonding wires are manufactured from high purity alloy constituents (99.999%).
• Their chemical composition is homogeneous, their mechanical properties are stable and the wire surfaces are smooth and clean.
• The highest purity materials
  These products exhibit excellent mechanical stability and are available in both standard (AlSi 1%) and corrosion resistant (AlMg) types.
• Aluminum Thick Wires- Our large diameter aluminum wires are an outstanding choice for power packages and discrete devices.
• Available in both corrosion resistant and standard types, they are bondable at low temperatures and low energy levels.

Copper Bonding Wires

Copper bonding wires have a high purity Cu matrix and achieve their excellent processing properties by means of defined addition elements.

They distinguish themselves by stable mechanical properties and the high reliability of the bonding joint, in particular as regards the reduced formation of Inter-metallic phases in comparison with the usual Au-Al system.

They are excellent for bonding with the ball / wedge process when using a reducing protective gas atmosphere.
Processing is also possible in the wedge / wedge bonding process. Copper bonding wires are, therefore, both technically and economically an alternative to gold wires.

A packaging concept tailor-made for Cu wires ensures that even after storage times of up to six months the wires can be readily processed.

Copper Fine Wires

Excellent mechanical and electrical properties allow our ultra-fine copper wires to be used in a variety of high-end, fine-pitch devices with higher lead counts and smaller pad sizes.

Copper Bonding Wires

In addition to the significantly lower cost of copper wires, slower inter-metallic growth in copper bonds provides superior reliability in high-power and discrete packages.

Pd Coated Copper Bonding Wire

Pd Copper Bonding wire is now be used widely because of its low cost in bonding and materials, improved performance in reliable and robust 2nd bond, simplified handing in longer floor/shelf life and oxidation protection.