3M Electrical Solutions Division
A full range of product, software and service solutions to help electronics manufacturers maintain an effective EOS/ESD control program.
3M Electrical Solutions Division Postings
92 news releases »
Mar 18, 2024 | ZESTRON is delighted to announce a collaborative presentation with Indium Corporation at the IPC APEX EXPO 2024. The presentation, titled "Advancements in Solder Paste Printing: Cleaning Compatibility Assessment of Jettable & Screen-Printable Pastes for Complex Electronics Assemblies," will be delivered by ZESTRON's Application Engineer, Kalyan Nukala, MS, PMP, and Indium Corporation's Product Specialist – Semiconductor and Advanced Assembly Materials, Evan Griffith, MEM.
XDry to Exhibit Advanced Humidity-Controlled Cabinets at 2024 IPC APEX EXPO
Mar 18, 2024 | XDry Corp. is set to exhibit at the 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024 at the Anaheim Convention Center in California. XDry invites attendees to visit Booth 2403 for an exclusive look at their state-of-the-art humidity-controlled cabinets designed to address the diverse needs of industries such as electronics, laboratory, aerospace and more.
SMTXTRA to Showcase Leading SMT Equipment Services at APEX
Mar 18, 2024 | SMTXTRA is excited to announce its participation in the upcoming 2024 IPC APEX EXPO, scheduled to take place from April 9-11, 2024 at the Anaheim Convention Center in California. SMTXTRA will be exhibiting at Booth 526, presenting its cutting-edge Repair, Maintenance & Servicing solutions with a focus on Fuji NXT heads, feeders, and various machines.
The APEX of electronics tooling – speed, cost, and performance.
Mar 18, 2024 | Impossible Objects proudly announces plans to exhibit at Apex 2024, scheduled to take place April, 9-11, 2024 at Anaheim Convention Center. The focus of this exhibition is the game-changing CBAM-25 industrial 3D printer, a true paradigm shift in high-speed, high-performance additive manufacturing.
MIRTEC to Showcase State-of-the-Art 3D AOI Solutions at APEX 2024
Mar 11, 2024 | MIRTEC will showcase its complete line of 3D AOI and SPI Inspection Systems at Booth #2100 during the 2024 IPC APEX EXPO scheduled to take place April 9-11, 2024, at the Anaheim Convention Center. "MIRTEC will feature a total of seven systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry including two new state-of-the-art 3D AOI Solutions," stated Brian D'Amico, President of MIRTEC's North American Sales and Service Division.
ZESTRON to Showcase Cutting-Edge Cleaning Solutions at IPC APEX EXPO 2024
Mar 11, 2024 | ZESTRON is excited to announce its participation in the upcoming IPC APEX EXPO 2024. The premier event for the electronics manufacturing industry will take place from April 9-11, 2024 at the Anaheim Convention Center in Anaheim, California.
ZESTRON to Present at Upcoming iMAPS Device Packaging Conference
Mar 04, 2024 | ZESTRON proudly announces Senior Application Engineer Ravi Parthasarathy will be presenting defluxing strategies for high-density advanced packaging with ultra-fine pitch die on Chip-on-Wafer (CoW) technology during his presentation at the upcoming iMAPS Device Packaging Conference (DPC) on Thursday, March 21, from 10:30 AM to 11:30 AM.
STMicroelectronics expands into 3D depth sensing with latest time-of-flight sensors
Feb 26, 2024 | STMicroelectronics (NYSE: STM) announced an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with market-leading 2.3k resolution, and revealed an early design win for the world's smallest 500k-pixel indirect Time-of-Flight (iToF) sensor.
ZESTRON to Host Equipment Demo Day & Open House at Manassas Technical Center
Feb 19, 2024 | ZESTRON is excited to announce its upcoming Equipment Demo Day & Open House, scheduled for March 6th, at the ZESTRON Technical Center in Manassas, VA. This event will be a unique opportunity for industry professionals to connect with top equipment manufacturers, gain firsthand experience with cleaning and defluxing equipment, and interact with industry experts.
Feb 12, 2024 | ZESTRON proudly announces that Senior Application Engineer Ravi Parthasarathy will be presenting a technical session titled "Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment: Navigating Cleaning Challenges" at the upcoming Surface Mount Technology Association (SMTA) Wafer Level Packaging Symposium.
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