3M Electrical Solutions Division

A full range of product, software and service solutions to help electronics manufacturers maintain an effective EOS/ESD control program.

3M Electrical Solutions Division Postings

92 news releases »

ZESTRON and Indium Corporation to Present Advancements in Solder Paste Printing at IPC APEX EXPO 2024

Mar 18, 2024 | ZESTRON is delighted to announce a collaborative presentation with Indium Corporation at the IPC APEX EXPO 2024. The presentation, titled "Advancements in Solder Paste Printing: Cleaning Compatibility Assessment of Jettable & Screen-Printable Pastes for Complex Electronics Assemblies," will be delivered by ZESTRON's Application Engineer, Kalyan Nukala, MS, PMP, and Indium Corporation's Product Specialist – Semiconductor and Advanced Assembly Materials, Evan Griffith, MEM.

XDry to Exhibit Advanced Humidity-Controlled Cabinets at 2024 IPC APEX EXPO

Mar 18, 2024 | XDry Corp. is set to exhibit at the 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024 at the Anaheim Convention Center in California. XDry invites attendees to visit Booth 2403 for an exclusive look at their state-of-the-art humidity-controlled cabinets designed to address the diverse needs of industries such as electronics, laboratory, aerospace and more.

SMTXTRA to Showcase Leading SMT Equipment Services at APEX

Mar 18, 2024 | SMTXTRA is excited to announce its participation in the upcoming 2024 IPC APEX EXPO, scheduled to take place from April 9-11, 2024 at the Anaheim Convention Center in California. SMTXTRA will be exhibiting at Booth 526, presenting its cutting-edge Repair, Maintenance & Servicing solutions with a focus on Fuji NXT heads, feeders, and various machines.

The APEX of electronics tooling – speed, cost, and performance.

Mar 18, 2024 | Impossible Objects proudly announces plans to exhibit at Apex 2024, scheduled to take place April, 9-11, 2024 at Anaheim Convention Center. The focus of this exhibition is the game-changing CBAM-25 industrial 3D printer, a true paradigm shift in high-speed, high-performance additive manufacturing.

MIRTEC to Showcase State-of-the-Art 3D AOI Solutions at APEX 2024

Mar 11, 2024 | MIRTEC will showcase its complete line of 3D AOI and SPI Inspection Systems at Booth #2100 during the 2024 IPC APEX EXPO scheduled to take place April 9-11, 2024, at the Anaheim Convention Center. "MIRTEC will feature a total of seven systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry including two new state-of-the-art 3D AOI Solutions," stated Brian D'Amico, President of MIRTEC's North American Sales and Service Division.

ZESTRON to Showcase Cutting-Edge Cleaning Solutions at IPC APEX EXPO 2024

Mar 11, 2024 | ZESTRON is excited to announce its participation in the upcoming IPC APEX EXPO 2024. The premier event for the electronics manufacturing industry will take place from April 9-11, 2024 at the Anaheim Convention Center in Anaheim, California.

ZESTRON to Present at Upcoming iMAPS Device Packaging Conference

Mar 04, 2024 | ZESTRON proudly announces Senior Application Engineer Ravi Parthasarathy will be presenting defluxing strategies for high-density advanced packaging with ultra-fine pitch die on Chip-on-Wafer (CoW) technology during his presentation at the upcoming iMAPS Device Packaging Conference (DPC) on Thursday, March 21, from 10:30 AM to 11:30 AM.

STMicroelectronics expands into 3D depth sensing with latest time-of-flight sensors

Feb 26, 2024 | STMicroelectronics (NYSE: STM) announced an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with market-leading 2.3k resolution, and revealed an early design win for the world's smallest 500k-pixel indirect Time-of-Flight (iToF) sensor.

ZESTRON to Host Equipment Demo Day & Open House at Manassas Technical Center

Feb 19, 2024 | ZESTRON is excited to announce its upcoming Equipment Demo Day & Open House, scheduled for March 6th, at the ZESTRON Technical Center in Manassas, VA. This event will be a unique opportunity for industry professionals to connect with top equipment manufacturers, gain firsthand experience with cleaning and defluxing equipment, and interact with industry experts.

ZESTRON to Present "Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment: Navigating Cleaning Challenges" at SMTA Wafer Level Packaging Symposium

Feb 12, 2024 | ZESTRON proudly announces that Senior Application Engineer Ravi Parthasarathy will be presenting a technical session titled "Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment: Navigating Cleaning Challenges" at the upcoming Surface Mount Technology Association (SMTA) Wafer Level Packaging Symposium.

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