CM-850 High Precision Automatic Solder Paste Printer

CM-850 High Precision Automatic Solder Paste Printer Description:

CM-850 is a high precision automatic solder paste printer designed for high precision screen printing in SMT industry.

Product Features：
Wide compatibility for PCB dimensions from 100mm x 80mm to 850mm x 500mm and PCB thickness from 0.8mm to 6mm.
High printing resolution
High positional accuracy, repeated positioning accuracy ±0.01mm; printing accuracy 0.025mm.
Support glue printing.
Automatic control improves production efficiency, quality control and saves production cost:
Automatic stencil positioning
Automatic PCB alignment
Automatic adjustment of squeegee pressure
Automatic printing
Automatic stencil cleaning (dry-type, wet-type and vacuum-type)
Adopt company independently developed suspended print head and programmable automatic pressure adjustment system with pressure closed-loop feedback. Support on-line real time pressure feedback and automatic squeegee pressure balancing. Accurate pressure control ensures perfect forming effect of solder paste.
Programmable motor controls demold speed and stroke between the squeegee and stencil, to realize multi-method demold.
Multi-functional PCB fixed positioning system, convenient and accurate PCB positioning.
Upward and downward visual positioning.
Built-in image processing system
Support 2D,SPC functions   

Applicable pitches of Components
SMT Components such as resistors, capacitors, inductors, diode and triode: 01005, 0201, 0402, 0603, 0805, 1206 and other specifications.
IC: support SOP, TSOP, TSSOP, QFN packaging, min. pitch 0.3 mm; support BGA, CSP packaging, min. ball diameter of 0.2 mm.
Printing size：100mm x 80mm ~850 mm x 500 mm
PCB Thickness：0.8 mm ~ 6 mm
FPC Thickness：thickness≦ 0.8 mm (excluding jig)

Applicable PCB Types
　　Applicable to PCB types of mobile phone, communication, LCD TV, STB, family cinema, vehicle electronics, medical power equipment, aerospace and aviation, besides general electronics products
　　
Specification
* The following data is obtained under ambient temperature of 25 ℃ and humidity of 60%

Items 　 　　               Parameter
Repeat Position Accuracy 　±0.01mm
Printing Accuracy　 　±0.025mm(Absolute Guarantees)
Cycle Time 　<15s (Excluding Printing & Cleaning)
Products Changeover　 　<5Min
Screen Stencil Size/Min 　737mm X 737mm（Note: Cleaning Adhesive tape shall be replaced for 737mm stencil）
Screen Stencil Size/Max 　1100mm X 900mm
Screen Stencil Thickness 　20mm ~ 40mm
PCB Size/Min 　100X80mm
PCB Size/Max 　850X500mm
PCB Thickness 　0.8~6mm
PCB Warpage Ratio 　＜1%（Based on diagonal length）
Bottom of Board Size 　13mm（standard configuration）, 25mm（optional configuration）
Edge of Board Size 　3mm
Transport Height 　900±40mm
Transport Direction 　Left-Right; Right-Left; Left-Left; Right-Right
Transport Speed 　100-1500mm/sec Programmable
Board Location Support System 　Magnetic pin/ Side support block/ Flexible automatic pin（optional）
Clamping System 　Elastic side clamping/Vacuum nozzle/Elastic Z-direction tabletting（optional）
Print head 　Programmable pneumatic control print head
Squeegee Speed 　10~200mm/sec
Squeegee Pressure 0~0.5MPa with adjustable pressure reducing meter valve
Squeegee Angle 　60°(Standard)/ 55°/ 45°
Squeegee Type 　Steel squeegee (standard), rubber squeegee, other types of squeegee customizable.
Stencil Separation Speed 　0.1~20mm/sec Programmable
Cleaning Methods 　Dry-type, wet-type, vacuum-type ( Programmable combination of Cleaning methods）
Table Adjustment Range 　X: ±8mm;Y:±10mm;θ:±2°
Type of Image Fiducial Mark 　Standard geometry shape of fiducial mark, bonding pad / stencil hole
Camera System 　Single digital camera with upward/downward vision system
Air Pressure 　4~6Kg/cm2
Air Consumption 　Approx 0.07m3 /min
Control Method 　PC Control
Power Supply 　AC:220±10%,50/60HZ 1φ 1.5KW
Machine Dimensions 　1560mm(L) x 1640mm(W) x 1520(H)mm (excluding the height of indicating lighthouse)
Weight 　Approx:1100Kg
Operation Temperature 　-20°C ~ +45°C
Operation Humidity 　30%~60%