GenX series X-ray Inspection Sytems

GenX series X-ray Inspection Sytems Description:

GenX Series X-ray Inspection Systems

The new GenX series x-ray inspection systems come in three model choices corresponding to the power level of their specific x-ray source and can be configured with various detectors to provide a wide range of high resolution imaging options that cater to different industry application needs from identifying solder joint opens, cold solder, and head in pillow defetcs to internal semiconductor component verification of bond wire attachments and die inspection. Combined with the PXi-Pro imaging analysis software, the GenX series systems provide a complete solution to a broad range of x-ray inspection requirements to industrial companies worldwide.