Copper Foil Composite Materia

Copper Foil Composite Materia Description:

Typical Applications
1.microprocessors and cache chips
2.aptop PCs and other high density, handheld portable electronics
3.high speed disk drives

Features/Benefits
1.component junction temperature reduction of 20??C is typical
2.easily added to existing designs to lower component temperatures, improve reliability
3.custom shapes available