X2.5L Automated X-Ray System for High-speed Final Inspection

X2.5L Automated X-Ray System for High-speed Final Inspection Description:

Automated inspection system designed for high-speed final inspection of printed circuit boards and complete assemblies.

The X2.5L is based on the well-established MatriX X2.5 system series. It is configured with a new generation of TDI X-ray cameras providing high speed, high sensitivity and high resolution. The configuration of the X2.5L allows the inspection of complete PCBs with only a few scans. In addition the MatriX X2.5L is equipped with one additional CMOS x-ray detector on an independent U/V stage. This allows high-speed off-axis image acquisition from different angles and directions with maximum image quality and resolution.

X-ray system features

• High Speed AXI System up to 400 mm/sec (Line Scan)
• Wide angle microfocus X-Ray (sealed), 130 kV/40 W
• High-speed readout TDI camera (Line Scanner)
• Scan width up to 100 mm
• Additional CMOS X-Ray detector (12 x 7cm, 14 bit digital output, 2k x 2k)
• 5-axes programmable motion system with X/Y sample table and CMOS detector on U/V motion axis
• Automatic grey-level and geometrical calibration
• Barcode scanner (1D/2D) for serial number and product type selection

Applications

• All standard SMDs and THT/PTH components
• Specific BGA and QFN algorithm
• Off-axis image analysis of e.g. BGA, THT
• Cooling plates/heatsink void inspection
• Assembly Completion Test
• Final Production Quality Test