Synapse Imaging Co., Ltd.
Manufacturer of 3D Solder Paste Inspection(SPI), PCB Substrate Inspection, Flip Chip Bump Inspection, LED Package & Substrate Inspection Equipment, Software Development and Solutions.
Consultant / Service Provider, Manufacturer
Since our establishment in year 2002, we have developed and supplied AOI (Automated Optical Inspection) systems based on unparalleled 2D and 3D vision technologies to market-leading semiconductors or electronics manufacturing companies in both domestic and international markets.
3D SPI (Solder Paste Inspection) machine with FAHP (Flying Absolute Height Profilometry) 3D measurement technolgoy has provided best reliable solutions for our customers.
2D and 3D vision technlogy developed by Synapse Imaging already applied not only for SPI equipment but also to variaties of Inspection system and equipment.
Product Lines;
- 3D SPI Equipment for In-Line and Table Top
- Ceramic Substrate Inspection Equipment
- Flip Chip Bump Insepction Equipment
- Semiconductor Substrate Inspection Equipment
- PCB Substrate Inspection Systems
- LED Package and Substrate Inspection Systems
- TFT-LCD Panel Insepction Systems
Technical Innovation Award at the 2009 Shanghai Nepcon Exhibition.
Listed on the Red Herrings Asia 200 list in year 2007.
ISO 9001/14001 Certification.
Synapse Imaging Co., Ltd. Postings
2 products »
3D XPI 5000L - In-Line SPI System
Technical Innovation The first 10 bit image processing in its industry by on-the-fly vibrationless scan (High speed & high precision image acquisition) 4 times higher height measurement resolution t...
3D Master 3000 neo / wide - Table Top SPI System
Description This device is designed to measure the shapes of 3-dimensional surfaces of objects that measure from dozen microns to a few millimeters, and is commonly used for measuring solder paste samples spread over PCBs automatic...
