SMT 158D High Thermal Conductive Underfill

SMT 158D High Thermal Conductive Underfill Description:

SMT 158D high thermal conductive underfill is a capillary flow underfill, low temperature cure, fast flowing, easy reworking liquid epoxy which can be used as a underfill for flip chip, chip scale package, ball grid array devices, package on package and land grid array application. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. It is designed for high production and friendly environment where process speed and mechanical shock are the key concern. This material is easily dispensed, minimizes induced stresses and provides outstanding reliability performance (e.g. temperature cycling performance) and excellent mechanical resistance. The performance of drop test has been improved by two orders of magnitude compared with that with the use of solder paste. 

• Diamond Filled Underfill
• High Thermal Conductivity (> 5 W/mK)
• No Resin Bleed