SMT Equipment

SMT 256EP Solder Joint Encapsulant Paste

SMT 256EP Solder Joint Encapsulant Paste

SMT 256EP Solder Joint Encapsulant Paste

Name:

SMT 256EP Solder Joint Encapsulant Paste

Category:

Materials

Offered by:

YINCAE Advanced Materials, LLC.

Company Information:

YINCAE Advanced Materials, LLC.

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, USA

Adhesives/Dispensing, Manufacturer of Assembly Material

  • Phone 5184522880

YINCAE Advanced Materials, LLC. website

Company Postings:

(26) products in the catalog

(15) technical library articles

(38) news releases

(5) job postings

SMT 256EP Solder Joint Encapsulant Paste Description:

SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and thermal conductivity, outstanding reliability, and easily rework. By comparison with soldering materials, SMT256EP solderable adhesives eliminate the out gassing from soldering process, flux residue issue and soldering bleed.  During the reflow process, Solder joint encapsulant adhesive removes metal oxide and encapsulates individual solder joints with enhancing solder joint to eliminate some drawbacks of underfilling (large CTE above Tg, trouble process control). The performance of drop test has been improved by two orders of magnitude compared with that with the use of solder paste. The polymer network can be removed using methyl ethyl ketone (MEK) or heating.

  • Low Temperature Soldering
  • High Temperature Applications
  • Excellent Pull Strength at High Temperatures

SMT 256EP Solder Joint Encapsulant Paste was added in Nov 2016

SMT 256EP Solder Joint Encapsulant Paste has been viewed 29 times

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