Engineered Materials Systems, Inc.

A global manufacturer of adhesives, conductives and encapsulants. For over 20 years, EMS has formulated state of the art acrylics, epoxies, silicones and urethanes.

OEM

Engineered Materials Systems, Inc, is a global formulator and manufacturer of adhesives, conductives and encapsulants serving the appliance, automotive, filter, lighting, medical and microelectronics markets.

For over 20 years, EMS has formulated state of the art acrylics, epoxies, silicones and urethanes. EMS’s goal is to fill a void in the industrial market utilizing materials for assembly. EMS believes all applications are unique and specific. Our ability to define, develop and create solutions for our customers is superior when compared to our competitors.

EMS is a market leader providing innovative and cost effective solutions for original equipment manufacturers. Our customer commitment is another reason why EMS maintains market leadership in providing excellent engineered materials.

At EMS, we are committed to designing our customers specific adhesives that fit their application needs. Browse this site for information on how our formulations will fit your needs.

Engineered Materials Systems, Inc. Postings

63 news releases »

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 05, 2017 | Engineered Material Systems announces the availability of 5 µm thick dry-film negative photoresists for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll or vacuum lamination and processing on MEMS and IC wafers.

Engineered Material Systems Introduces a New Low-Temperature Cure Electrically Conductive Adhesive

Dec 03, 2017 | Engineered Material Systems is pleased to debut its CA-183 low temperature cure electrically conductive adhesive. The low cost, flexible adhesive is designed for die attach and general circuit assembly applications.

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 22, 2017 | Engineered Material Systems is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Oct 18, 2017 | Engineered Material Systems is pleased to debut its 631-68 UV plus thermal cured adhesive for bonding lens holders in camera module applications.

Engineered Material Systems to Showcase Liquid and Dry Film Negative Tone Photoresists at MicroTAS

Sep 13, 2017 | Engineered Material Systems is pleased to announce plans to exhibit at MicroTAS, scheduled to take place Oct. 22-26, 2017 in Savannah, GA. The company will showcase both liquid and dry-film negative photoresists for use in microfluidics, wafer level packaging and CMOS applications (TSV sealing/passivation). These material formulations have been optimized for spin coating (liquid) or hot roll lamination (dry-film) and processing on MEMS and IC wafers.

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 | Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and heterojunction solar modules. The CA-150 Series will be shown for the first time at the EU PVSEC Photovoltaic Exhibition, scheduled to take place September 25-28, 2017 in Amsterdam, The Netherlands.

New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging

Aug 10, 2017 | Engineered Material Systems is pleased to introduce the DF-3590 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

May 01, 2017 | Engineered Material Systems announces plans to show its CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules at Intersolar Europe. The new conductive adhesive will be displayed in Hall A2, booth 319 at Intersolar Europe, scheduled to take place May 31-June 2, 2017 in Munich, Germany.

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Apr 22, 2017 | Engineered Material Systems is pleased to introduce the DF-4014 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

Mar 22, 2017 | Engineered Material Systems is pleased to debut its 631-39 UV plus thermal cured adhesive for bonding lens holders in camera module applications.

53 more news releases from Engineered Materials Systems, Inc. »

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