Engineered Materials Systems, Inc.

A global manufacturer of adhesives, conductives and encapsulants. For over 20 years, EMS has formulated state of the art acrylics, epoxies, silicones and urethanes.

OEM

Engineered Materials Systems, Inc, is a global formulator and manufacturer of adhesives, conductives and encapsulants serving the appliance, automotive, filter, lighting, medical and microelectronics markets.

For over 20 years, EMS has formulated state of the art acrylics, epoxies, silicones and urethanes. EMS’s goal is to fill a void in the industrial market utilizing materials for assembly. EMS believes all applications are unique and specific. Our ability to define, develop and create solutions for our customers is superior when compared to our competitors.

EMS is a market leader providing innovative and cost effective solutions for original equipment manufacturers. Our customer commitment is another reason why EMS maintains market leadership in providing excellent engineered materials.

At EMS, we are committed to designing our customers specific adhesives that fit their application needs. Browse this site for information on how our formulations will fit your needs.

Engineered Materials Systems, Inc. Postings

56 news releases »

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

May 01, 2017 | Engineered Material Systems announces plans to show its CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules at Intersolar Europe. The new conductive adhesive will be displayed in Hall A2, booth 319 at Intersolar Europe, scheduled to take place May 31-June 2, 2017 in Munich, Germany.

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Apr 22, 2017 | Engineered Material Systems is pleased to introduce the DF-4014 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

Mar 22, 2017 | Engineered Material Systems is pleased to debut its 631-39 UV plus thermal cured adhesive for bonding lens holders in camera module applications.

Engineered Material Systems, Inc. Develops Negative Photoresist for MEMS and IC Wafers

Mar 20, 2017 | Engineered Material Systems is pleased to introduce the DF-35120 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). The dry film is 120 µm thick. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Material Systems to Showcase CA-150 Series Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Mar 14, 2017 | Engineered Material Systems announces the introduction of its new CA-150 Series Snap Cure, Low Cost Conductive Adhesive for stringing and shingling crystalline silicon and Heterojunction solar modules. The new conductive adhesive will be displayed in Hall W3, booths 806/807 at the SNEC PV Power Expo, scheduled to take place April 19-21, 2017 in Shanghai, China.

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Jan 09, 2017 | Engineered Material Systems is pleased to introduce the DF-3560 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Nov 14, 2016 | Engineered Materials Systems is pleased to introduce its new EMS 561-567 Low-Cost Snap Cure Conductive Adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. EMS 561-567 is designed to electrically interconnect solar cells using ribbons or direct cell-to-cell contact.

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications

Oct 04, 2016 | Engineered Material Systems is pleased to debut its 640-35 (dam) and 640-46 (fill) dam and fill UV cured chip encapsulants for chip-on-board smart card applications.

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

Sep 13, 2016 | Engineered Materials Systems today announced its new EMS 561-338 Fast Cure Conductive Adhesive for die attach applications with small to medium size die. EMS 561-338 is designed to cure in less than one minute at 150ºC.

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Sep 08, 2016 | Engineered Material Systems is pleased to introduce the DF-3520 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

46 more news releases from Engineered Materials Systems, Inc. »

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