Engineered Materials Systems, Inc.

A global manufacturer of adhesives, conductives and encapsulants. For over 20 years, EMS has formulated state of the art acrylics, epoxies, silicones and urethanes.

OEM

Engineered Materials Systems, Inc, is a global formulator and manufacturer of adhesives, conductives and encapsulants serving the appliance, automotive, filter, lighting, medical and microelectronics markets.

For over 20 years, EMS has formulated state of the art acrylics, epoxies, silicones and urethanes. EMS’s goal is to fill a void in the industrial market utilizing materials for assembly. EMS believes all applications are unique and specific. Our ability to define, develop and create solutions for our customers is superior when compared to our competitors.

EMS is a market leader providing innovative and cost effective solutions for original equipment manufacturers. Our customer commitment is another reason why EMS maintains market leadership in providing excellent engineered materials.

At EMS, we are committed to designing our customers specific adhesives that fit their application needs. Browse this site for information on how our formulations will fit your needs.

Engineered Materials Systems, Inc. Postings

69 news releases »

Engineered Material Systems to Showcase Next Generation Electrically Conductive Adhesives at Intersolar Europe

Jun 11, 2018 | Engineered Material Systems today announced that it will exhibit at the Intersolar Europa Solar Power Expo, scheduled to take place June 20-22, 2018 in Munich, Germany. The company will showcase its next-generation low cost conductive adhesives for stringing, shingling and back contact applications in crystalline silicon and heterojunction solar modules in Hall A2, booth 315.

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

May 08, 2018 | Engineered Material Systems announces plans to exhibit at the SNEC PV Power Expo, scheduled to take place May 28-30, 2018 in Shanghai, China. The company will showcase its CA-150 Series snap cure, low-cost conductive adhesive for stringing and shingling crystalline silicon and heterojunction solar modules in Hall W3, Booth 806.

New Non-Conductive Die Attach Adhesive for Image Sensors & Circuit Assembly Applications

Mar 12, 2018 | Engineered Material Systems is pleased to debut its DA-6010 Non-Conductive Die Attach Adhesive designed for image sensor attach or chip on board applications.

EMS Introduces Dry Film Negative Photoresist for Sealing Through-Silicon Vias in CMOS Wafers

Mar 08, 2018 | Engineered Material Systems is pleased to introduce the availability of its DF-3500 series dry-film negative photoresists for wafer level sealing of through-silicon vias. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B)

Jan 28, 2018 | Engineered Material Systems is pleased to debut its 506-03A/B, which is a two-component epoxy system with a convenient 1:1 volumetric mix ratio designed to pass rigorous reliability requirements.

Engineered Material Systems to Showcase Jet Dispense SMT at IPC APEX EXPO

Jan 28, 2018 | ngineered Material Systems will exhibit its jet dispensable SMT adhesives at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca.

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 05, 2017 | Engineered Material Systems announces the availability of 5 ┬Ám thick dry-film negative photoresists for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll or vacuum lamination and processing on MEMS and IC wafers.

Engineered Material Systems Introduces a New Low-Temperature Cure Electrically Conductive Adhesive

Dec 03, 2017 | Engineered Material Systems is pleased to debut its CA-183 low temperature cure electrically conductive adhesive. The low cost, flexible adhesive is designed for die attach and general circuit assembly applications.

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 22, 2017 | Engineered Material Systems is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Oct 18, 2017 | Engineered Material Systems is pleased to debut its 631-68 UV plus thermal cured adhesive for bonding lens holders in camera module applications.

59 more news releases from Engineered Materials Systems, Inc. »

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