Teledyne DALSA

Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services.

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Established in 1980, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Our core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.

Teledyne DALSA has earned its reputation as a global leader in high performance imaging and semiconductors. Teledyne DALSA, its employees and partners are committed to enabling industry, art and exploration through innovative technology. Specialties: MEMs, integrated circuit and electronics technology, machine vision, software, framegrabbers, semiconductor, wafer processing, CMOS, CCD.

Teledyne DALSA Postings

1 technical article »

Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift

Sep 07, 2017 | Young K. Song and Vanja Bukva

As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized....

SMT Replacement Nozzles

reflow oven profiler