Advanced Thermal Management

Advanced Thermal Management Description:

S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air without the use of fluxes. They also allow for the rework of damaged parts. Some of the specific applications that can benefit from this are in avionics, laser systems, and high performance engine parts. S-Bond joining has been applied to make a wide range of components, including:

• Vapor Chambers
• Phase Change Thermal Storage Devices
• Radiators
• Heat Pipes
• Cold Plates