Martin MiniOven-04 - Desk Top Reflow Oven

For Reballing and Prebumping of SMD Components

The new MiniOven-04 is perfectly suitable for a wide range of applications, from small QFNs to very
large BGAs. This is due to our extensive selection of stencils and masks for almost any standard chip. For new components, we will design and manufacture stencils on request - a service which MARTIN has successfully provided for many years.

The MINIOVEN 04 provides a fully-fledged reflow environment in a very compact form.  This tabletop equipment is ideal for Pre-Bumping of QFNs and also for Reballing of BGAs and CSPs.

Perfect temperature management is foremost.  The efficient hot gas circulation ensures optimal heating of the component and a controlled reflow process.  For especially stringent demands for the highest soldering quality the MINIOVEN is also available with a gas connection for processing gases, such as nitrogen, argon and formic.

The MINIOVEN is controlled via an intuitive menu from the display.  Up to 99 profiles, through the system software component specifically adjusted, can be stored.  In addition to this tabletop oven MARTIN offer an extensive range stock stencils; bespoke versions can be realised at short notice.

Martin MiniOven-04 product family:

• MINIOVEN 04S - Very compact table top reflow oven to reball or pre-bump BGA, CSP or QFN comonents. Combined IR and convection heating technology achieves controlled reflow of solder material (spheres and paste).
• MINIOVEN 04N - Very compact table top reflow oven to reball or pre-bump BGA, CSP or QFN comonents under process gas athmosphere. Combined IR and convection heating technology achieves controlled reflow of solder material (spheres and paste).