SMT Equipment

MARTIN Reball 3.1 / Prebump 3.1

MARTIN Reball 3.1 / Prebump 3.1

MARTIN Reball 3.1 / Prebump 3.1

Name:

MARTIN Reball 3.1 / Prebump 3.1

Category:

Rework & Repair Equipment

Offered by:

MARTIN (a Finetech company)

Company Information:

MARTIN (a Finetech company)

Manufacturer of rework and reballing systems, hand soldering solutions, and micro-dispensing technologies

Manchester, New Hampshire, USA

Adhesives/Dispensing, Manufacturer of Assembly Equipment, Repair/Rework, Soldering

  • Phone 603-627-8989

MARTIN (a Finetech company) website

Company Postings:

(6) products in the catalog

(2) technical library articles

(8) news releases

MARTIN Reball 3.1 / Prebump 3.1 Description:

Cost Effective Equipment for Reballing and Prebumping BGAs, CSPs and QFNs

Thanks to our proven technology there is a cost reduction of about 50% compared with previous solutions. The complete process takes approximately 3 minutes and thus optimises rework throughput.

For all BGAs, CSPs, QFNs

The complete set Reball 03.1 comprises everything needed for the reballing of virtually any BGA patterns and sizes.

BGAs are simply set into the universal holder using the supplied frames; the universal masks in turn are adjusted to the relevant array with the use of kapton tape.

High volume and special applications or CSPs and QFNs may call for specific expansion kits from our range of optional extras.

Features:

  • Control unit Hot Reball 03 with basic equipment, SMD hook, kapton tape and cutter
  • Universal eco holder for BGAs 45 x 45 mm
  • 7 eco adapter frames for BGAs from 15 x 15 to 40 x 40 mm
  • 2 universal eco masks for all BGAs with1.27 mm ball pitch

MARTIN Reball 3.1 / Prebump 3.1 was added in Mar 2011

MARTIN Reball 3.1 / Prebump 3.1 has been viewed 1453 times

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