Surface Mount Technology Products and Services
SMT Products and Services offered by MARTIN (a Finetech company)
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MARTIN Reball 3.1 / Prebump 3.1 |
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MARTIN Reball 3.1 / Prebump 3.1 - Video Demonstration
Cost Effective Equipment for Reballing and Prebumping BGAs, CSPs and QFNs
Thanks to our proven technology there is a cost reduction of about 50% compared with previous solutions. The complete process takes approximately 3 minutes and thus optimises rework throughput.
For all BGAs, CSPs, QFNs
The complete set Reball 03.1 comprises everything needed for the reballing of virtually any BGA patterns and sizes.
BGAs are simply set into the universal holder using the supplied frames; the universal masks in turn are adjusted to the relevant array with the use of kapton tape.
High volume and special applications or CSPs and QFNs may call for specific expansion kits from our range of optional extras.
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MARTIN Reball 3.1 / Prebump 3.1 was added in Mar 2011
MARTIN Reball 3.1 / Prebump 3.1 has been viewed 974 times