Titan Loadlocked RIE or PECVD with Vacuum Cassette Elevator

Company Information:

Trion provides versatile plasma equipment (ICP-RIE, PECVD, PVD, Ashers, and more) to enable our customers in the MEMS, Semiconductor, LED, RF Power, F.A., Opto-, III-V, Wafer Level Packaging, Thin Film Head, and Solar industries.

Clearwater, Florida, USA

Manufacturer

(727)461-1888

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Company Postings:

(9) products in the catalog

Name:	Titan Loadlocked RIE or PECVD with Vacuum Cassette Elevator
Category:	Surface Finish
Offered by:	Trion Technology

Titan Loadlocked RIE or PECVD with Vacuum Cassette Elevator Description:

The Titan is a very compact, fully automated, vacuum loadlocked plasma system for semi-conductor production. Available in either Reactive Ion Etch (RIE) configuration, High Density Inductive Coupled Plasma (HDICP) or Plasma Enhanced Chemical Vapor Deposition (PECVD) configuration. Used for advanced processing of wafers or mounted parts. It also has multiple size batch capability. Small footprint at an affordable price.

Etch Applications: Gallium Arsenide, Aluminum Gallium Arsenide, Gallium Nitride, Indium Phosphide, Aluminum, Silicides, Chrome and other materials requiring both corrosive and non-corrosive chemistries.

Deposition Applications: Silicon dioxide, Silicon Nitride, Oxynitride, and various other materials.

For more information: http://www.triontech.com .... Email: info@triontech.com .... Phone: +1 727-461-1888

Titan Loadlocked RIE or PECVD with Vacuum Cassette Elevator was added in Oct 2016

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