BF-X3 3D Automated X-ray Inspection (AXI) System

BF-X3 3D Automated X-ray Inspection (AXI) System Description:

Saki's automated high-resolution 3D X-ray inspection and measurement systems enable high image quality defect detection. Saki's systems are based on reliable hardware design, superior reliability, safety, and ease of maintenance, and are backed by a worldwide service and support network.

Saki's 3D inline AXI product line consists of the:

• BF-X2 225kV system for semiconductor and insulated gate bipolar transistor (IGBT) power module inspection
• BF-X2 160kV in-line 3D automated X-ray inspection system for high power resolution
• BF-X3 system for printed circuit board assembly

Saki 3D AXI systems are based on Saki's unique Planar Computed Tomography (PCT) technology that captures 3D images of slices of the board, package, or module and reconstructs them in real time in a high-speed production setting. The process completely separates the top and bottom-side images of the board, measures components and features, determines placement variance and warpage, identifies and classifies the defects, such as dry joints and voids, and generates the associated data. The systems are built on a one-ton granite base with a rigid gantry structure for stability that delivers extremely reliable, consistent, clear images and results and ensures the thermal stability, parallelism, and flatness necessary for perfect positioning. All Saki systems adhere to the highest safety requirements and are based on European standards.

High-resolution 3D data is used for all image acquisition, inspection, and analysis. A high-resolution image of each defect is displayed immediately, enabling prompt viewing and analysis and eliminating the need for further analytical equipment. Such precision machine control, 3D reconstruction, 3D inspection, and 3D viewing are all unique developments of Saki.