SMT Equipment

Size, Weight & Power Reduction (SWaP) Services

Size, Weight & Power Reduction (SWaP) Services

Size, Weight & Power Reduction (SWaP) Services

Name:

Size, Weight & Power Reduction (SWaP) Services

Category:

Design Services

Offered by:

STI Electronics

View Size, Weight & Power Reduction (SWaP) Services on STI Electronics website

Company Information:

STI Electronics

Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly in the electronics industry.

Madison, Alabama, USA

Assembly, Contract Manufacturer, Design, IPC Standards Certification Center, Training Provider

  • Phone 256-461-9191
  • Fax 256-461-7524

STI Electronics website

Company Postings:

(19) products in the catalog

(48) upcoming training courses

(1) technical library article

(222) news releases

Size, Weight & Power Reduction (SWaP) Services Description:

Military and aerospace electronics providers continue to push the technological envelope to design and manufacture leading edge electronics for today's users. Current design problems are not driven by circuit design capabilities but by an inability to reliably package these circuits within the space constraints. Innovative packaging techniques are required in order to meet the size, weight, and power (SWaP) reduction requirements of this industry without sacrificing reliability or performance.

STI’s design engineers utilize conventional hybrid and microelectronics technologies to enable our customers to meet their SWaP requirements in addition to STI’s patented packaging technology termed Imbedded Component/Die Technology (IC/DT®). IC/DT® enables the manufacturing and assembly of smaller, lighter, and more technologically advanced high density circuit card assemblies where conventional packaging technologies fall short through imbedding unpackaged components in a 3-D laminate substrate with integrated thermal management. STI’s IC/DT® packaging approach addresses miniaturization, thermal management, performance, reliability, and system capability requirements through innovative design guidelines and materials selection in order to meet form, fit, and function requirements.

  • Reduced Form Factor
  • Miniaturized Components
  • Increased Performance
  • Ruggedized Applications
  • Reduced Interconnects
  • Space Constraints
  • Imbedded and/or Stacked Components
  • Low-Weight Solutions
  • Light Weight Interconnects

View Size, Weight & Power Reduction (SWaP) Services on STI Electronics website

Size, Weight & Power Reduction (SWaP) Services was added in Apr 2016

Size, Weight & Power Reduction (SWaP) Services has been viewed 747 times

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