SMT Equipment

Microelectronics Packaging

Company Information:

STI Electronics

Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly in the electronics industry.

Madison, Alabama, USA

Assembly, Contract Manufacturer, Design, IPC Standards Certification Center, Training Provider

  • Phone 256-461-9191
  • Fax 256-461-7524

STI Electronics website

Company Postings:

(19) products in the catalog

(91) upcoming training courses

(1) technical library article

(219) news releases

(3) job postings

Microelectronics Packaging Description:

This div will be replaced by the JW Player.

STI Capabilities

The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to design and develop highly integrated hardware to meet shrinking form and fit factor requirements as well as increasing thermal loads. Emerging packaging materials are continuously evaluated to optimize electrical and thermal performance.

The microelectronics lab specializes in state-of-the-art packaging design and assembly including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as STI’s patented packaging technology termed Imbedded Component/Die Technology (IC/DT®).

STI’s involvement in research and development programs, both in component packaging technologies and electronics assembly manufacturing, has brought about the installation of the latest and most advanced equipment and the acquisition of the top people in this field. STI is staffed to design, develop, assemble, and test a ruggedized electronics assembly in an advanced cleanroom laboratory (Class 1000/ISO Class 6 certified) to meet our customer’s specifications. A Class 1000/ISO Class 6 cleanroom provides the optimum environment for prototype and low volume microelectronics manufacturing and assembly production.

Assembly materials such as printed circuit boards (PCBs), components, and wire are stored in dry nitrogen cabinets to reduce contamination and degradation. A sophisticated dispenser/placement machine is used for low volume dispense accuracy and repeatability in addition to ±10 μm component placement. Component pick options include waffle pack and wafer for high-precision SMT and bare die, including flip chip assembly. Wire bond interconnect is accomplished with a fully automatic ultrasonic wedge bonder utilizing aluminum wire over a wide diameter range for low and high current applications. A two-channel mass flow controller plasma system is employed to prepare surfaces for die attach, wire bonding, and encapsulation. Material qualification and process control are accomplished via a bond tester coupled with high magnification visual inspection.

View Microelectronics Packaging on STI Electronics website

Microelectronics Packaging was added in Apr 2016

Microelectronics Packaging has been viewed 793 times

18 More Products from STI Electronics :

See All »

392 more "Assembly Services" Products:

See All »

Rework Training Materials

SMT Custom Nozzles