Ultra SPI - 3D Solder Paste Inspection System
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Ultra SPI - 3D Solder Paste Inspection System Description:
MVP’s enhanced Ultra SPI Solder Paste Inspection systems deploy our patented 3D technologies along with MVPs trusted AOI capabilities. Utilizing MVP’s patented technology, 3D Solder Paste Inspection (SPI) can be performed on paste for apertures as small as 01005 and Micro-BGA. In addition MVP’s latest SPI solutions provide support for Dual Lane, Multiple Panel Inspection and microelectronics as well as full SPC reporting and data outputs.
- Full Solder Paste Inspection (SPI)
- Standard Gerber Import Utilities
- Fastest Programming
- Accurate Defect Identification
- Ultimate Flexibility
- Accurate Height Measurement for SMT and Microelectronics Processes
Ultra SPI - 3D Solder Paste Inspection System was added in Apr 2015
Ultra SPI - 3D Solder Paste Inspection System has been viewed 495 times
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