Ultra 850XB BGA and Packaging AOI

Ultra 850XB BGA and Packaging AOI Description:

Semiconductor Packaging Solutions - Component Inspection.

The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for in-tray BGA and package inspection. In addition a range of custom material handling configurations are available including; JEDEC tray handling, magazine handling, strip handling, and wafer handling. For in-line operations, single and dual lane options are also available to process microelectronic or semiconductor assemblies.

The 850G XB flying inspection technology ensures in-tray inspection rather than movement of the substrate within the inspection bay.

Our configurable electro-optics solutions provide performance inspection capabilities for:

• BGA and Packaging
• Ball Height and Coplanarity Measurements
• Ball Diameter and Shape Measurements
• Ball Offset Measurements
• Missing Ball and Bridging defects
• Coining and Damage
• Substrate Damage
• Full graphical ease-of-use set up ultilities

Quad Color Technology

MVP’s Quad-Color Technology allows faster inspection cycle times while increasing inspection capabilities. Additionally, it helps broaden the defect coverage and lower false rejects.

Tri-Color Technology complements MVP’s wide range of award winning AOI products and further allows the introduction of flexible solutions with the capability to increase performance and speed metrics at the same time.

Software Tools and Quality Control

Innovative tools such as ePro, Validate, Auto-Optimize and iRepair, ease the programming process while still providing the highest quality programs.

Global Service and Support

MVP recognizes the global nature of the electronics industry and has set itself up in a position to be able to follow its customers around the globe. As a consequence, a cornerstone of our service strategy is to provide local support so that close client partnerships can be developed and maintained over time.

MVP's application engineering support is provided by our local distributor in each country and by our three head offices, the world headquarters in California, the European head office in the UK, and MVP's Asia-Pacific office in Shanghai, China. We offer local engineering support within 24 hours, and application engineers from headquarters are available for assistance within 36 hours.