Surface Mount Technology companies
Leading provider of full-field metrology solutions for substrates and packages in the OEM/CEM/SATS/PCB segments of the microelectronics industry.
Akrometrix is a Georgia-based company founded in 1994 to provide services and equipment to measure and resolve thermo-mechanical surface flatness issues in manufacturing and assembly operations, most notably in the production of electronic circuit substrates and components. Its pioneering technology was based on the research of Dr. I. Charles Ume, a professor at the Georgia Institute of Technology (Georgia Tech). Akrometrix licensed and commercialized the application of Dr. Ume's technology, which today serves as a crucial component in the production, and continued miniaturization, of advanced electronics products.
Akrometrix has become the industry leader in real-time metrology emphasizing resolution of thermo-mechanical issues at all levels of electronic materials production, components fabrication and assembly processes.
Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for use as a laboratory tool, today's generation of TherMoiré p...
Aug 19, 2014 | Ken Chiavone
Warpage management consists of planning, measuring, analyzing, sharing, and reacting to data related to the surface shapes of electronics components as they change throughout the reflow assembly process. Leading semiconductor manufacturers have had warpage management systems in place for ten years or more, mainly because microchip package warpage must be understood and compensated for in order to attain high assembly yields. Similarly, newer device architectures such as package-on-package and system-on-a-chip are sensitive to warpage-related assembly issues, and companies involved in the manufacture and assembly of these devices tend to have the most advanced warpage management programs....
Aug 19, 2014 | Ken Chiavone
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly....
Aug 19, 2014 | Ken Chiavone
Understanding warpage of package attach locations on PCBs under reflow temperature conditions is critical in surface mount technology. A new industry standard, IPC 9641, addresses this topic directly for the first time as an international standard.
This paper begins by summarizing the sections of the IPC 9641 standard, including, measurement equipment selection, test setup and methodology, and accuracy verification. The paper goes further to discuss practical implementation of the IPC 9641 standards. Key advantages and disadvantages between available warpage measurement methods are highlighted. Choosing the correct measurement technique depends on requirements for warpage resolution, data density, measurement volume, and data correlation. From industry experience, best practice recommendations are made on warpage management of PCB land areas, covering how to setup, run, analyze, and report on local area PCB warpage.
The release of IPC 9641 shows that flatness over temperature of the package land area on the PCB is critical to the SMT industry. Furthermore, compatibility of shapes between attaching surfaces in SMT, like a package and PCB, will be critical to product yield and quality in years to come....
Mar 13, 2008 | Dr. Jiahui Pan, Ryan Curry, Neil Hubble and Dr. Dirk A. Zwemer, Akrometrix.
Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC), are used to measure temperature-dependent warpage for a PBGA package and a PCB component land site from room temperature to 250ºC. The results are qualitatively similar, but imaging resolution and noise properties create offsets between coplanarity values. The paper summarizes strengths and weaknesses for each technique....
Jan 21, 2015 | Akrometrix will exhibit in Booth #2935 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will demonstrate the Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during a microelectronics production reflow profile.
Oct 14, 2014 | Akrometrix LLC will present and exhibit at the 36th International Electronics Manufacturing Technology Conference (IEMT), scheduled to take place November 11-13, 2014 at the Renaissance Johor Bahru Hotel in Johor, Malaysia.
Aug 26, 2014 | Akrometrix LLC will exhibit in Booth #541 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Aug 26, 2014 | Akrometrix LLC is pleased to announce the appointment of TELTEC as its representative throughout Europe.