Akrometrix

Leading provider of full-field metrology solutions for substrates and packages in the OEM/CEM/SATS/PCB segments of the microelectronics industry.

OEM, Service Provider

Akrometrix is a Georgia-based company founded in 1994 to provide services and equipment to measure and resolve thermo-mechanical surface flatness issues in manufacturing and assembly operations, most notably in the production of electronic circuit substrates and components. Its pioneering technology was based on the research of Dr. I. Charles Ume, a professor at the Georgia Institute of Technology (Georgia Tech). Akrometrix licensed and commercialized the application of Dr. Ume's technology, which today serves as a crucial component in the production, and continued miniaturization, of advanced electronics products.

Akrometrix has become the industry leader in real-time metrology emphasizing resolution of thermo-mechanical issues at all levels of electronic materials production, components fabrication and assembly processes.

Akrometrix Postings
6 products »
TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool

3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage....

Test Equipment

TherMoiré® AXP - Thermal Warpage and Strain Measurement Tool
CXP - Cost Effective Thermal Warpage Measurement Tool

The CXP (Convection Expandable Platform) is a low cost, stand alone equipment primarily targeted at the EMS and PCB Fab Market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolutio...

Test Equipment

CXP - Cost Effective Thermal Warpage Measurement Tool
TherMoiré® PS600S Thermal Warpage Measurement Tool

The TherMoiré® PS600S is a metrology solution that utilizes the shadow moiré measurement technique combined with a...

Test Equipment

TherMoiré® PS600S Thermal Warpage Measurement Tool
TherMoiré® PS200S - Thermal Warpage and Strain Measurement Tool

The TherMoiré® PS200S is a metrology solution that utilizes the shadow moiré measurement technique combined with a...

Test Equipment

TherMoiré® PS200S - Thermal Warpage and Strain Measurement Tool
AKM600P - Wafer/Panel Thermal Warpage Measurement Tool

The AKM600P is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to charac...

Test Equipment

AKM600P - Wafer/Panel Thermal Warpage Measurement Tool
Akrometrix Studio - PCB Surface Characterization and Analysis Software

Akrometrix Studio is an advanced set of integrated software modules that work together to provide the most comprehensive set of surface characterization and analysis capabilities available. When used with the TherMoiré AXP surface measureme...

Software

Akrometrix Studio - PCB Surface Characterization and Analysis Software
4 technical articles »
Implementing Warpage Management: A Five-Step Process for EMS Providers

Aug 19, 2014 | Ken Chiavone

Warpage management consists of planning, measuring, analyzing, sharing, and reacting to data related to the surface shapes of electronics components as they change throughout the reflow assembly process. Leading semiconductor manufacturers have had warpage management systems in place for ten years or more, mainly because microchip package warpage must be understood and compensated for in order to attain high assembly yields. Similarly, newer device architectures such as package-on-package and system-on-a-chip are sensitive to warpage-related assembly issues, and companies involved in the manufacture and assembly of these devices tend to have the most advanced warpage management programs....

Advanced Second Level Assembly Analysis Techniques - Troubleshooting Head-In-Pillow, Opens, and Shorts with Dual Full-Field 3D Surface Warpage Data Sets/

Aug 19, 2014 | Ken Chiavone

SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly....

Ready to Start Measuring PCB Warpage during Reflow? Why and How to Use the New IPC-9641 Standard

Aug 19, 2014 | Ken Chiavone

Understanding warpage of package attach locations on PCBs under reflow temperature conditions is critical in surface mount technology. A new industry standard, IPC 9641, addresses this topic directly for the first time as an international standard.

This paper begins by summarizing the sections of the IPC 9641 standard, including, measurement equipment selection, test setup and methodology, and accuracy verification. The paper goes further to discuss practical implementation of the IPC 9641 standards. Key advantages and disadvantages between available warpage measurement methods are highlighted. Choosing the correct measurement technique depends on requirements for warpage resolution, data density, measurement volume, and data correlation. From industry experience, best practice recommendations are made on warpage management of PCB land areas, covering how to setup, run, analyze, and report on local area PCB warpage.

The release of IPC 9641 shows that flatness over temperature of the package land area on the PCB is critical to the SMT industry. Furthermore, compatibility of shapes between attaching surfaces in SMT, like a package and PCB, will be critical to product yield and quality in years to come....

Comparing Techniques for Temperature-Dependent Warpage Measurement

Mar 13, 2008 | Dr. Jiahui Pan, Ryan Curry, Neil Hubble and Dr. Dirk A. Zwemer, Akrometrix.

Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC), are used to measure temperature-dependent warpage for a PBGA package and a PCB component land site from room temperature to 250ºC. The results are qualitatively similar, but imaging resolution and noise properties create offsets between coplanarity values. The paper summarizes strengths and weaknesses for each technique....

21 news releases »
Akrometrix Wins a 2017 NPI Award for Its Next Generation AXP Shadow Moiré System at APEX

Feb 15, 2017 | Akrometrix is pleased to announce that it has been awarded a 2017 NPI Award in the category of First Article Inspection for the new AXP 2.0. The award was presented to the company during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

Next Generation AXP Shadow Moiré System.
Akrometrix to Showcase Next-Generation AXP Shadow Moiré System at APEX

Jan 10, 2017 | Akrometrix will exhibit in Booth #704 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The company will demonstrate its next-generation Shadow Moiré System – the AXP 2.0.

Next-Generation AXP Shadow Moiré System.
Akrometrix Announces Next-Generation AXP Shadow Moiré System

Oct 04, 2016 | Akrometrix today announced its next-generation Shadow Moiré System – the AXP 2.0.

Next-generation Shadow Moiré System – the AXP 2.0.
Understanding PCB Design & Material Warpage Challenges – Learn More at SMTAI

Sep 23, 2016 | Akrometrix today announced that Ryan Curry, Technical Account Manager, will co-present a paper with Don Adams, Manufacturing Engineering Manager at Bose Corporation, during SMTA International. The presentation, “Understanding PCB Design and Material Warpage Challenges Which Occur during B2B/Module-Carrier Attachment,” is scheduled to take place during session APT7, “Package and PCB Interactions,” on Wednesday, September 28th at 4 p.m.

Ryan Curry, Technical Account Manager.
Akrometrix Announces New Schedule for Technical Presentations

Sep 22, 2016 | Akrometrix today announced its upcoming schedule for technical presentations:

Akrometrix Announces the Release of the CRE6, Convection Reflow Emulation for Warpage Metrology

May 05, 2016 | Akrometrix today announced that the company released its next-generation Convection Reflow Emulation Module (CRE6) for warpage metrology.

Akrometrix Announces the Shipment of Its 300th Shadow Moiré System

Apr 29, 2016 | Akrometrix today announced that the company has shipped its 300th shadow moiré metrology system to a leading back-end company in South Korea.

Akrometrix Announces Enhanced Digital Image Correlation (DIC) Module

Mar 30, 2016 | Akrometrix today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms.

Akrometrix Announces Automated Die Attach Tilt Metrology

Feb 25, 2016 | Akrometrix today announced that it has developed an automated die-board (or daughter-mother board) attach tilt metrology. All Akrometrix shadow moiré or DFP systems (AXPs) can be upgraded with the new feature.

Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech

Feb 23, 2016 | Akrometrix will exhibit in Booth #108 at the GOMACTech 2016 Conference, scheduled to take place March 14-17, 2016 in Orlando, Fl. Established in 1968, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC, and provides a forum for government reviews.

Shape matching at peak reflow temperature.

11 more news from Akrometrix »

Contact information

Akrometrix

2700 NE Expressway Building B, Suite 500
Atlanta, Georgia, 30345
USA

  • Phone 404-486-0880
  • Fax 404-486-0890

Visit Akrometrix website

Manufacturing Software

SMT Replacement Nozzles