Akrometrix

Leading provider of full-field metrology solutions for substrates and packages in the OEM/CEM/SATS/PCB segments of the microelectronics industry.

OEM, Service Provider

Akrometrix is a Georgia-based company founded in 1994 to provide services and equipment to measure and resolve thermo-mechanical surface flatness issues in manufacturing and assembly operations, most notably in the production of electronic circuit substrates and components. Its pioneering technology was based on the research of Dr. I. Charles Ume, a professor at the Georgia Institute of Technology (Georgia Tech). Akrometrix licensed and commercialized the application of Dr. Ume's technology, which today serves as a crucial component in the production, and continued miniaturization, of advanced electronics products.

Akrometrix has become the industry leader in real-time metrology emphasizing resolution of thermo-mechanical issues at all levels of electronic materials production, components fabrication and assembly processes.

Akrometrix Postings
2 products »
TherMoiré AXP - Flatness Measurement and Analysis System

The TherMoiré AXP is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time...

Other

TherMoiré AXP - Flatness Measurement and Analysis System
LineMoiré Platform - Automated Flatness Inspection System

The substrate (PCB/chip-carrier/silicon/etc.) is literally the foundation upon which over 90% of value-added processing is performed in the microelectronics supply chain. Substrate flatness compliance is being driven by first pass yield objecti...

Inspection

LineMoiré Platform  - Automated Flatness Inspection System
4 technical articles »
Implementing Warpage Management: A Five-Step Process for EMS Providers

Aug 19, 2014 | Ken Chiavone

Warpage management consists of planning, measuring, analyzing, sharing, and reacting to data related to the surface shapes of electronics components as they change throughout the reflow assembly process. Leading semiconductor manufacturers have had warpage management systems in place for ten years or more, mainly because microchip package warpage must be understood and compensated for in order to attain high assembly yields. Similarly, newer device architectures such as package-on-package and system-on-a-chip are sensitive to warpage-related assembly issues, and companies involved in the manufacture and assembly of these devices tend to have the most advanced warpage management programs....

Advanced Second Level Assembly Analysis Techniques - Troubleshooting Head-In-Pillow, Opens, and Shorts with Dual Full-Field 3D Surface Warpage Data Sets/

Aug 19, 2014 | Ken Chiavone

SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly....

Ready to Start Measuring PCB Warpage during Reflow? Why and How to Use the New IPC-9641 Standard

Aug 19, 2014 | Ken Chiavone

Understanding warpage of package attach locations on PCBs under reflow temperature conditions is critical in surface mount technology. A new industry standard, IPC 9641, addresses this topic directly for the first time as an international standard.

This paper begins by summarizing the sections of the IPC 9641 standard, including, measurement equipment selection, test setup and methodology, and accuracy verification. The paper goes further to discuss practical implementation of the IPC 9641 standards. Key advantages and disadvantages between available warpage measurement methods are highlighted. Choosing the correct measurement technique depends on requirements for warpage resolution, data density, measurement volume, and data correlation. From industry experience, best practice recommendations are made on warpage management of PCB land areas, covering how to setup, run, analyze, and report on local area PCB warpage.

The release of IPC 9641 shows that flatness over temperature of the package land area on the PCB is critical to the SMT industry. Furthermore, compatibility of shapes between attaching surfaces in SMT, like a package and PCB, will be critical to product yield and quality in years to come....

Comparing Techniques for Temperature-Dependent Warpage Measurement

Mar 13, 2008 | Dr. Jiahui Pan, Ryan Curry, Neil Hubble and Dr. Dirk A. Zwemer, Akrometrix.

Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC), are used to measure temperature-dependent warpage for a PBGA package and a PCB component land site from room temperature to 250ºC. The results are qualitatively similar, but imaging resolution and noise properties create offsets between coplanarity values. The paper summarizes strengths and weaknesses for each technique....

2 news releases »
Akrometrix LLC to Demonstrate 2D/3D Statistical Review Software at SMTAI – Interface Analysis

Aug 26, 2014 | Akrometrix LLC will exhibit in Booth #541 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

TELTEC to Represent Akrometrix LLC Surface Measurement Tools in Europe

Aug 26, 2014 | Akrometrix LLC is pleased to announce the appointment of TELTEC as its representative throughout Europe.

Contact information

Akrometrix

2700 NE Expressway Building B, Suite 500
Atlanta, Georgia, 30345
United States

  • Phone 404-486-0880
  • Fax 404-486-0890

Visit Akrometrix website

SP700avi inline stencil printer

PCB Depaneling Systems