Leading provider of full-field metrology solutions for substrates and packages in the OEM/CEM/SATS/PCB segments of the microelectronics industry.

OEM, Service Provider

Akrometrix is a Georgia-based company founded in 1994 to provide services and equipment to measure and resolve thermo-mechanical surface flatness issues in manufacturing and assembly operations, most notably in the production of electronic circuit substrates and components. Its pioneering technology was based on the research of Dr. I. Charles Ume, a professor at the Georgia Institute of Technology (Georgia Tech). Akrometrix licensed and commercialized the application of Dr. Ume's technology, which today serves as a crucial component in the production, and continued miniaturization, of advanced electronics products.

Akrometrix has become the industry leader in real-time metrology emphasizing resolution of thermo-mechanical issues at all levels of electronic materials production, components fabrication and assembly processes.

Akrometrix Postings
3 products »
TherMoiré - In-Process Warpage Measurement Systems

3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warp...


TherMoiré - In-Process Warpage Measurement Systems
CXP - PCB Surface Measurement System

The CXP (Convection Expandable Platform) is a low cost, stand alone equipment primarily targeted at the EMS and PCB Fab Market. The CXP uses the Digital Fringe Projection technique to measure a field of view of 64x48mm with a measurement resolu...


CXP - PCB Surface Measurement System
Akrometrix Studio - PCB Surface Characterization and Analysis Software

Akrometrix Studio is an advanced set of integrated software modules that work together to provide the most comprehensive set of surface characterization and analysis capabilities available. When used with the TherMoiré AXP surface measur...


Akrometrix Studio - PCB Surface Characterization and Analysis Software
4 technical articles »
Implementing Warpage Management: A Five-Step Process for EMS Providers

Aug 19, 2014 | Ken Chiavone

Warpage management consists of planning, measuring, analyzing, sharing, and reacting to data related to the surface shapes of electronics components as they change throughout the reflow assembly process. Leading semiconductor manufacturers have had warpage management systems in place for ten years or more, mainly because microchip package warpage must be understood and compensated for in order to attain high assembly yields. Similarly, newer device architectures such as package-on-package and system-on-a-chip are sensitive to warpage-related assembly issues, and companies involved in the manufacture and assembly of these devices tend to have the most advanced warpage management programs....

Advanced Second Level Assembly Analysis Techniques - Troubleshooting Head-In-Pillow, Opens, and Shorts with Dual Full-Field 3D Surface Warpage Data Sets/

Aug 19, 2014 | Ken Chiavone

SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally been used to establish pass/fail limits. As surface mount components become smaller, with denser interconnect arrays, and processes such package-on-package assembly become prevalent, advanced methods using dual surface full-field data become critical for effective Assembly Planning, Quality Assurance, and Failure Analysis. A more complete approach than just measuring the coplanarity of the package is needed. Analyzing the gap between two surfaces that are constantly changing during the reflow thermal cycle is required, to effectively address the challenges of modern SMT assembly....

Ready to Start Measuring PCB Warpage during Reflow? Why and How to Use the New IPC-9641 Standard

Aug 19, 2014 | Ken Chiavone

Understanding warpage of package attach locations on PCBs under reflow temperature conditions is critical in surface mount technology. A new industry standard, IPC 9641, addresses this topic directly for the first time as an international standard.

This paper begins by summarizing the sections of the IPC 9641 standard, including, measurement equipment selection, test setup and methodology, and accuracy verification. The paper goes further to discuss practical implementation of the IPC 9641 standards. Key advantages and disadvantages between available warpage measurement methods are highlighted. Choosing the correct measurement technique depends on requirements for warpage resolution, data density, measurement volume, and data correlation. From industry experience, best practice recommendations are made on warpage management of PCB land areas, covering how to setup, run, analyze, and report on local area PCB warpage.

The release of IPC 9641 shows that flatness over temperature of the package land area on the PCB is critical to the SMT industry. Furthermore, compatibility of shapes between attaching surfaces in SMT, like a package and PCB, will be critical to product yield and quality in years to come....

Comparing Techniques for Temperature-Dependent Warpage Measurement

Mar 13, 2008 | Dr. Jiahui Pan, Ryan Curry, Neil Hubble and Dr. Dirk A. Zwemer, Akrometrix.

Three full-field optical techniques, shadow moiré, fringe projection and digital image correlation (DIC), are used to measure temperature-dependent warpage for a PBGA package and a PCB component land site from room temperature to 250ºC. The results are qualitatively similar, but imaging resolution and noise properties create offsets between coplanarity values. The paper summarizes strengths and weaknesses for each technique....

6 news releases »
Mayson Brooks Joins Akrometrix LLC as President & CEO

Jul 01, 2015 | Akrometrix is pleased to announce that Mayson Brooks has joined the company as President & CEO, effective July 6, 2015. Mr. Brooks brings significant experience in semiconductor inspection and metrology for both front and back-end applications, especially in advanced packaging, which is an excellent fit for the strategic direction of Akrometrix.

Mayson Brooks President & CEO.
Akrometrix LLC’s CXP to Be Displayed at SMT/Hybrid/Packaging 2015

Apr 07, 2015 | Akrometrix will display the latest surface measurement equipment platform, the CXP, in the Microtronic Booth, #7-101L, at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg Germany.

Akrometrix LLC’s CXP.
Akrometrix LLC to Demonstrate 2D/3D Interface Analysis Software at APEX

Jan 21, 2015 | Akrometrix will exhibit in Booth #2935 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will demonstrate the Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during a microelectronics production reflow profile.

Shape matching at peak reflow temperature.
Akrometrix LLC to Present PoP Reflow Assembly Findings at IEMT

Oct 14, 2014 | Akrometrix LLC will present and exhibit at the 36th International Electronics Manufacturing Technology Conference (IEMT), scheduled to take place November 11-13, 2014 at the Renaissance Johor Bahru Hotel in Johor, Malaysia.

Ken Chiavone, Vice President of Engineering
Akrometrix LLC to Demonstrate 2D/3D Statistical Review Software at SMTAI – Interface Analysis

Aug 26, 2014 | Akrometrix LLC will exhibit in Booth #541 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.

TELTEC to Represent Akrometrix LLC Surface Measurement Tools in Europe

Aug 26, 2014 | Akrometrix LLC is pleased to announce the appointment of TELTEC as its representative throughout Europe.

Contact information


2700 NE Expressway Building B, Suite 500
Atlanta, Georgia, 30345
United States

  • Phone 404-486-0880
  • Fax 404-486-0890

Visit Akrometrix website

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