Spectrum Integrity, Inc.
Spectrum Integrity is a full service Engineering Design Service Firm. We are a Solution Provider for companies requiring outstanding hardware designs for advanced RF, High-Speed, and Semiconductor Test applications.
Consultant / Service Provider, Manufacturer
RF, Microwave, High-Speed, and Flex Circuit Design and Fabrication; High-Frequency Test Sockets
We specialize in working with fast moving, high-tech companies. Our objectives are to provide you with the highest quality engineering, extend very competitive pricing, offer a total turn-key solution, and free you to focus on other areas of your business.
We are fully capable of undertaking designs with little information. Our multi-disciplinary engineering staff and certified PCB designers are capable of handling component selection and researching datasheets to assist in schematic design and netlist creation.
Standard Services
- Advanced PCB Design and Fabrication
- RF and Microwave Designs up to 65 GHz
- Flex Circuit Design
- PCB Design with "cavities" for die
- Chip-on-Board and Chip-on-Flex
- Product Demonstration Boards
- High Performance Semiconductor Test Hardware
- Custom Test Sockets
- Mechanical Design
Additional Capabilities
- Semiconductor Burn-in Board design
- Ceramic Substrate Design
- Metal-backed PCB Design
- Custom RF Probe Card Design
- Oversee fabrication and Assembly
- Re-work or Re-Design of existing designs
Spectrum Integrity, Inc. Postings
1 technical article »
High Performance Multilayer PCBs Design and Manufacturability
Oct 31, 2013 | Judy Warner, Chris Savalia; Transline Technology, Michael Ingham; Spectrum Integrity
Multilayer printed circuit boards (PCBs) that utilize high performance materials are inherently far more challenging for a fabricator to build, due to significant material property differences over standard epoxy glass FR4. These unique material characteristics often require higher processing temperatures, special surface treatments (to aid in hole and surface plating), they possess different expansion properties, making layer-to-layer registration more difficult to control, and require many other unique considerations....
