Surface Mount Technology Industry Directory
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Finetech
Innovative equipment solutions for nearly every kind of rework or micro assembly challenge, including the latest advanced packages.
categories: Manufacturer of Assembly Equipment, Repair/Rework, Soldering
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Complete BGA Rework Station
The core businesses of Finetech are in the fields of precision component placement, flip chip and optoelectronic bonding, and SMT rework. The company services customers in a broad range of industries including aerospace, medical technology, consumer electronics, semiconductor, optoelectronics, military and universities. Finetech works with companies from the start-up phase to large multi-user corporations.
In November 2009, Finetech acquired Martin GmbH, a manufacturer of rework and dispensing equipment located in Wessling, Germany. With the acquisition, Finetech offers the complete rework range -- from simple hand soldering solutions, stand-alone BGA reball ovens and entry-level rework systems to advanced rework equipment for complex applications.
The product range includes different types of Fineplacer systems (manual, semi-automatic and automatic rework stations or bonding and assembly platforms) and a wide range of additional tools and modules. Depending of specific configurations, the Fineplacer systems are suitable for R&D and prototype environments (high-accuracy, low-volume) as well as for more fully-automated production with higher volumes / higher rework yields.
Finetech Postings
Finetech has 12 product(s) in the catalog »
category: Rework
Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet ve...
category: Assembly
Fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applicatio...
category: Assembly
A semi-automatic bonder representing the latest development from Finetech. Encompassing the "...
category: Assembly
A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the sm...
category: Assembly
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach...
category: Rework
High Density Rework Station The FINEPLACER® pico rs is an enhanced hot air rework station...
category: Rework
Future in Advanced Rework The FINEPLACER® matrix rs is a semi-automatic rework station re...
category: Rework
FINEPLACER® core - with a high efficiency small board heater developed for rework of small si...
category: Assembly
Bonding of Laser Bars The FINEPLACER® pico ama is a cost effective, fully-automated bonde...
category: Rework
Automated Hot Air Rework Station The FINEPLACER® jumbo rs is a hot air rework station ded...
category: Rework
The FINEPLACER® micro hvr is a cost effective, fully-automated rework station, offering a hig...
category: Rework
The FINEPLACER® micro rs is an enhanced hot air rework station for assembly and rework of all...
Finetech has 83 news release(s) »
Donated Finetech Die Bonder Installed at Pennsylvania State University
Mar 11, 2013 | A FINEPLACER® Pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University.
Jan 16, 2013 | Finetech will highlight the FINEPLACER® core rework system in booth #1205 at the upcoming IPC APEX EXPO
Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West
Jan 04, 2013 | Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder
Oct 03, 2012 | Finetech will highlight the FINEPLACER® core rework system in the Finetech/Martin Booth #236 at the upcoming SMTA International Conference and Expo
MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show
Sep 26, 2012 | MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system at the upcoming Mississauga EPTECH Electronics Show,
MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012
Sep 10, 2012 | MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.
High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego
Sep 05, 2012 | Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition
Pennsylvania State University Wins Finetech Die Bonder Donation
Aug 29, 2012 |
Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012.
MARTIN’s EXPERT 04.6IXM: Reworking Heavy Substrates
Jun 04, 2012 | MARTIN has expanded its successful EXPERT 04.6 rework station series with a new configuration to rework LEDs and power components on heavy (metal or ceramic) boards.
May 31, 2012 | MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Upper Midwest Expo & Tech Forum
Contact information
Finetech
8380 S Kyrene Road Suite #110
Tempe, Arizona, 85284
United States
Finetech - USA/East
915 Holt Avenue - Unit 1 ,
Manchester 03109, New Hampshire,
United States
Phone: +1 603 627 8989 
Fax: +1 480 893 1632
Email
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