Surface Mount Technology companies
Innovative equipment solutions for nearly every kind of rework or micro assembly challenge, including the latest advanced packages.
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Complete BGA Rework Station
The core businesses of Finetech are in the fields of precision component placement, flip chip and optoelectronic bonding, and SMT rework. The company services customers in a broad range of industries including aerospace, medical technology, consumer electronics, semiconductor, optoelectronics, military and universities. Finetech works with companies from the start-up phase to large multi-user corporations.
In November 2009, Finetech acquired Martin GmbH, a manufacturer of rework and dispensing equipment located in Wessling, Germany. With the acquisition, Finetech offers the complete rework range -- from simple hand soldering solutions, stand-alone BGA reball ovens and entry-level rework systems to advanced rework equipment for complex applications.
The product range includes different types of Fineplacer systems (manual, semi-automatic and automatic rework stations or bonding and assembly platforms) and a wide range of additional tools and modules. Depending of specific configurations, the Fineplacer systems are suitable for R&D and prototype environments (high-accuracy, low-volume) as well as for more fully-automated production with higher volumes / higher rework yields.
Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet ve...
Fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applicatio...
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach...
High Density Rework Station The FINEPLACER® pico rs is an enhanced hot air rework station...
Future in Advanced Rework The FINEPLACER® matrix rs is a semi-automatic rework station re...
Automated Hot Air Rework Station The FINEPLACER® jumbo rs is a hot air rework station ded...
The FINEPLACER® micro hvr is a cost effective, fully-automated rework station, offering a hig...
Mar 11, 2013 | A FINEPLACER® Pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University.
Jan 16, 2013 | Finetech will highlight the FINEPLACER® core rework system in booth #1205 at the upcoming IPC APEX EXPO
Jan 04, 2013 | Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder
Oct 03, 2012 | Finetech will highlight the FINEPLACER® core rework system in the Finetech/Martin Booth #236 at the upcoming SMTA International Conference and Expo
Sep 26, 2012 | MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system at the upcoming Mississauga EPTECH Electronics Show,
Sep 10, 2012 | MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.
Sep 05, 2012 | Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition
Aug 29, 2012 | Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012.
Jun 04, 2012 | MARTIN has expanded its successful EXPERT 04.6 rework station series with a new configuration to rework LEDs and power components on heavy (metal or ceramic) boards.
May 31, 2012 | MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA Upper Midwest Expo & Tech Forum
8380 S Kyrene Road Suite #110
Tempe, Arizona, 85284
Finetech - USA/East
915 Holt Avenue - Unit 1 ,
Manchester 03109, New Hampshire, United States