Hentec Industries, Inc. (RPS Automation)
Hentec Industries, Inc. designs and manufacturers high quality precision machines for use in selective soldering, lead tinning, and solderability testing applications.
Consultant / Service Provider, Manufacturer
Hentec Industries, Inc (formerly RPS Automation, LLC) designs and manufactures a complete line of high precision selective soldering, lead tinning and solderability test equipment for electronics and circuit board manufacturing and assembly. Hentec/RPS has over 20 years of automated soldering experience and more than 1100 installations worldwide. Customers range from aerospace, military, communications and medical device manufacturers to industrial OEM, auto and contract manufacturers big and small. All systems are built in the USA and feature precision robotics, easy to use software, extensive warranty coverage, and exceptional customer service. Hentec/RPS builds success one customer at a time.
Hentec/RPS stands apart in the industry for its high quality soldering, low maintenance and durability. These strengths are the result of an aggressive commitment to R&D, yielding such innovations as Gaussian nozzles, proprietary Nitrogen management systems, and highly durable solder pot and pump designs. Hentec/RPS systems set the standard for thermal performance, keep-away, wave height, solder stability, and software ease-of use.
Hentec Industries, Inc. (RPS Automation) Postings
9 products »
Dip and Look Systems - Pulsar Solderability System
“Dip & Look Test”— The Pulsar provides precise handling of electronic components for the automated process of a flux and solder dip of the component terminations. A...
Steam Aging Systems - Photon Steam Age System
Meets ANSI-J-STD002, ANSI-J-STD003, JEDEC JESD22-B102D, MIL-STD-202, IEC-68-2-54. Complete monitoring and control of steam or water temperature. Features include: Automatic timing of the test duration, digital indicator for elapsed time and...
1 technical article »
Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components
Aug 08, 2022 | Reid Henry
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing....
86 news releases »
May 03, 2022 | Solderability testing determines the solderability of electronic component terminations by providing the degree of wetting necessary to form robust solder interconnections.
Hentec/RPS Appoints Precision Automation as Exclusive New England Sales Representative
Apr 15, 2022 | Precision Automation will represent all Hentec/RPS selective soldering, lead tinning and solderability test products throughout entire New England region.
Apr 11, 2022 | Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Hentec/RPS to Exhibit Selective Soldering Systems at SMTA Huntsville Expo & Tech Forum on April 12th
Apr 04, 2022 | Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Vyrian Incorporated Purchases Hentec/RPS Pulsar Solderability Test and Photon Steam Aging Systems
Mar 28, 2022 | Pulsar solderability test system determines how well molten solder will wet on solderable surfaces of electronic components.
Hentec/RPS Appoints LaPa Enterprises as Northern California Sales Representative
Mar 21, 2022 | LaPa Enterprises will represent all Hentec/RPS selective soldering, lead tinning and solderability test products throughout Northern California, and Nevada.
Hentec/RPS to Exhibit at SMTA Dallas Expo & Tech Forum in Plano, Texas on March 22nd
Mar 14, 2022 | Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Holt Integrated Circuits Finalizes Purchase of Hentec/RPS Odyssey 1325 Lead Tinning System
Mar 07, 2022 | Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
STP Electronics Orders Hentec/RPS Vector 300 Selective Soldering System for Installation in France
Feb 22, 2022 | Vector 300 offers unmatched thermal capability, rapid programming, and simplistic elegance in operation.
Hentec/RPS Receives Order from Spirit Electronics for Photon Steam Aging System
Feb 14, 2022 | Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.
76 more news releases from Hentec Industries, Inc. (RPS Automation) »
