SMT Equipment

SE500-D™ Dual Lane 3D SPI

Company Information:

CyberOptics Corporation

CYBEROPTICS is a global leader in high-precision 3D sensors that significantly improve yields and productivity in the 3D scanning and metrology, Surface Mount Technology & Semiconductor Markets

Minneapolis, Minnesota, USA

Inspection

  • Phone (763) 542-5000
  • Fax (763) 542-5100

CyberOptics Corporation website

Company Postings:

(12) products in the catalog

(3) technical library articles

(152) news releases

SE500-D™ Dual Lane 3D SPI Description:

Largest Board Capability With Flexible Conveyor Configuration.

The SE500-D™ Dual Lane 3-D SPI System takes solder paste inspection to the next level with its flexible conveyor setup design and large board capability comparable with major SMT suppliers. SE500-D™ combines innovative design with on-the-fly inspection technology using strobed white light to inspect even the most demanding assemblies at > 80 cm²/sec with zero compromise on measurement accuracy and repeatability.

With SE500-D™ you can maximize production utilization and transform your production process to achieve high quality solder joints through accurate volume measurement of solder paste deposits.

Flexibility At Its Best

The SE500-D™ features a smart conveyor design solution providing maximum flexibility to cater to varying PCB widths. This unique design gives you the convenience of inspecting different board sizes on different lanes or even switching from dual lane to single lane mode to inspect very large boards.

With SE500-D™, you can also inspect different programs on different lanes as well as perform synchronous or asynchronous inspection.

Large Board Capability

SE500-D™ supports a wide range of PCB sizes to help you inspect small and large boards with ease. Its board handling capability is specially designed to match leading upstream and downstream SMT suppliers’ specifications.

Distinct Sensing Technology

The SE500-D™ leverages CyberOptics’ core sensing technology to provide a calibration-free sensor design with no machine-to-machine variation.

Specifications:

Board Size (Max.)
Single Lane Mode
Dual Lane Mode
510 x 590 mm
510 x 300 mm
Board Size (Min.) 50 x 50 mm
Inspection Speed @ 30µm 80cm²/sec
Inspection Speed @ 15µm 50cm²/sec
Gage R&R <<10%, 6σ

View SE500-D™ Dual Lane 3D SPI on CyberOptics Corporation website

SE500-D™ Dual Lane 3D SPI was added in Jun 2015

SE500-D™ Dual Lane 3D SPI has been viewed 1122 times

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