The International Electronics Manufacturing Initiative’s mission is to identify and close technology gaps, which includes the development and integration of the electronics industry supply infrastructure. This industry-led consortium is made up of more than 65 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. iNEMI is based in Herndon, Virginia (near Washington, D.C.), with regional offices in Shanghai, China and Limerick, Ireland. For additional information, visit www.inemi.org.
iNEMI (International Electronics Manufacturing Initiative) Postings
Jul 16, 2015 | Haley Fu; iNEMI, Prabjit Singh, Levi Campbell, Jing Zhang; IBM Corporation, Wallace Ables; Dell Corporation, Dem Lee, Jeffrey Lee; iST-Integrated Service Technology, Jane Li, Solomon Zhang; Lenovo Limited Corporation, Simon Lee; The Dow Chemical Company.
Qualification of electronic hardware from a corrosion resistance standpoint has traditionally relied on stressing the hardware in a variety of environments. Before the development of tests based on mixed flowing gas (MFG), hardware was typically exposed to temperature-humidity cycling. In the pre-1980s era, component feature sizes were relatively large. Corrosion, while it did occur, did not in general degrade reliability. There were rare instances of the data center environments releasing corrosive gases and corroding hardware. One that got a lot of publicity was the corrosion by sulfur-bearing gases given off by data center carpeting. More often, corrosion was due to corrosive flux residues left on as-manufactured printed circuit boards (PCBs) that led to ion migration induced electrical shorting. Ion migration induced failures also occurred inside the PCBs due to poor laminate quality and moisture trapped in the laminate layers....
Nov 10, 2011 | John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the coplanarity of both the substrate package and the PCB motherboard. The iNEMI PCB Coplanarity WG generated a snapshot in time of the dynamic coplanarity ...
Jun 07, 2013 | The Counterfeit Components Project of the International Electronics Manufacturing Initiative (iNEMI) today released a whitepaper entitled, "Development of a Methodology to Determine Risk of Counterfeit Use."
May 23, 2013 | The Counterfeit Components Assessment Project of the International Electronics Manufacturing Initiative (iNEMI) will hold two open webinars to help the electronics manufacturing supply chain better manage their risk of counterfeit components.
May 14, 2013 | Cloud computing, sustainability & recycling, and the explosive growth of MEMS & sensors are among leading trends
Feb 06, 2009 | Input will help the electronics industry improve test implementation and coverage
Apr 23, 2008 | European workshop scheduled for 18 June at IMEC in Leuven, Belgium
Mar 24, 2008 | North American workshop is May 14
Nov 13, 2007 | Photo available (see note at end of release)
Nov 02, 2007 | Book provides in-depth information for implementing
Jan 15, 2007 | Forum on lead-free processes and summit on reliability are also planned
Nov 08, 2006 | Workshop Scheduled for January 24 in Silicon Valley